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8 Layer HDI PCB 32u Gold Finger High TG180 Multilayer
8 Layer HDI PCB 32u Gold Finger High TG180 Multilayer
Specifications
Place of Origin :
Shenzhen,China
Brand Name :
ONESEINE
Certification :
ISO9001,ISO14001
Model Number :
ONE-102
MOQ :
1pcs
Price :
USD0.1-1000
Packaging Details :
Vacuun bag
Delivery Time :
5-8 working days
Payment Terms :
T/T,Western Union
Supply Ability :
1000000000pcs/mon
Layer Count :
8
Step Count :
1
Finish :
Gold Finger
Thickness :
32u
Technology :
HDI
Product Type :
PCB
Description

8 Layers 1 Step Gold Finger 32u HDI Multilayer PCB Fabrication

PCB parameter:

Plate used: FR-4

Number of layers: 8

Board thickness: 1.0+/-0.1mm

Surface treatment: Immersion gold, OSP, electric gold finger 32u

Application area: memory board

Features: Drilling 1-3 4-5 6-8

Elite 8-Layer HDI PCBs: 32μm Microvias + 1-Step Gold Fingers for Mission-Critical Connectivity


China’s Advanced Fabrication for Aerospace, Medical & Defense Systems

The High-Density Reliability Crisis
When surgical robots, satellite payloads, and industrial automation demand 250,000+ mating cycles and 110GHz signal integrity, conventional PCBs fail at critical junctures:

Gold finger delamination after 10k insertions

Microvia cracking under thermal shock

Impedance drift >±10% in HDI designs

Signal loss spikes at millimeter-wave frequencies

Engineered Solution: Our 8-layer 32μm HDI PCBs with 1-step electrolytic gold fingers deliver:

50μ" Hard Gold (5× industry thickness)

Laser-drilled 32μm µvias (aspect ratio 1:1.2)

±3% impedance control @ 40GHz

Tg180 FR4/High-Speed Hybrid stackups

Why Global OEMs Specify This Technology


1. Gold Finger Dominance
1-Step Electrolytic Plating:

50μ" gold hardness >200HK (vs. 100HK ENIG)

300K mating cycles @ 50N force (MIL-G-45204)

Laser-Cut Bevels: 30°±0.5° with Ra<0.1μm

Wrap-Around Plating: 360° edge coverage prevents cracking

2. 32μm HDI Breakthroughs
Microvia-in-Pad: 0.15mm pitch BGA support

Stacked µvias: 8:1 aspect ratio for 16Gb/s signals

Copper Filling: 100% void-free via fill (X-ray verified)

3. Signal Integrity Mastery
Hybrid Dk Control: εr=3.48±0.02 (1-40GHz)

Near-Zero Loss: <0.002dB/mm @ 110GHz

EMI Shielding: -55dB crosstalk via hatched grounds

Certified Applications


Surgical Robotics

8-layer HDI + gold fingers for tool interfaces

0.008mm² misregistration (ISO 13485 compliant)

Survives 1,000 autoclave cycles

Satellite RF Switches

32μm µvias enable Ka-band beamforming

PIM <-168dBc @ 2x43dBm

NASA-STD-8739.4 certified

Industrial Backplanes

1-step gold fingers @ 250K hot-swap cycles

25Gbps ARINC 818 video transmission

UL 94V-0 + IP68 conformal coating

China’s Competitive Edge


Speed & Precision

10-Day Prototypes with full test reports

25-Day Volume Production (30k panels/month)

Cost Transformation

45% savings vs. North American fabs

Zero NRE for design optimization

Technical Partnership

Free HDI DFM analysis (IPC-2226)

Signal integrity simulations (HFSS 3D)

On-site failure forensics

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8 Layer HDI PCB 32u Gold Finger High TG180 Multilayer

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Product Detail
Place of Origin :
Shenzhen,China
Brand Name :
ONESEINE
Certification :
ISO9001,ISO14001
Model Number :
ONE-102
MOQ :
1pcs
Price :
USD0.1-1000
Contact Supplier
8 Layer HDI PCB 32u Gold Finger High TG180 Multilayer

ONESEINE TECHNOLOGY CO.,LTD

Verified Supplier
1 Years
foshan
Since 2013
Business Type :
Manufacturer
Main Products :
HF PCB, Rogers PCB Board, Multilayer PCB Board
Total Annual :
1000000-5000000
Employee Number :
100~200
Certification Level :
Verified Supplier
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