Circular Custom Glass Parts Fused Quartz Substrate With Six Bottom Surface Bosses

This circular fused quartz substrate features six precisely machined bottom surface bosses, engineered for semiconductor and optical thin-film processing. With a compact 15mm diameter and double-sided fine grinding, the integral boss structure lifts the substrate off the carrier surface, eliminating contact-area contamination and ensuring uniform coating performance.

Product Parameters

Key Features

• Integral Precision Machining – Six bottom bosses machined from a single fused quartz blank, ensuring consistent boss height and positional accuracy for reliable substrate performance.
• Bosses Lift Structure – Protruding bosses create a gap between substrate and carrier, preventing adhesive contact, liquid pooling, and uneven coating during deposition processes.
• Double-Sided Fine Grinding – Both top and bottom surfaces precision-ground for superior flatness, ensuring uniform thin-film deposition across the entire substrate area.
• High Temperature & Chemical Resistance – Fused quartz material withstands high-temperature processing environments and resists standard semiconductor cleaning chemicals without degradation.
• Low Stress & Stability – Minimal internal stress with excellent dimensional stability, maintaining precision tolerances through repeated thermal cycling.

Applications

1. Semiconductor Coating

Chip and wafer coating carrier substrate. The six bottom bosses suspend the substrate above the carrier plate, ensuring uniform film deposition without adhesion to the base plate—improving process yield and repeatability.

2. Optical Evaporation

Vacuum coating fixture pad for optical components. The boss structure prevents bottom surface scratching and residual liquid accumulation, maintaining optical surface quality during multi-layer coating processes.

3. Laboratory High-Temperature Sintering

Powder specimen support platform for high-temperature sintering. The ventilated gap created by the bosses promotes even heat distribution across the sample, preventing localized overheating.

4. Optoelectronic Component Packaging

Precision bonding and positioning substrate for optoelectronic components. The boss protrusions serve as adhesive-limiting boundaries, controlling bond line thickness for consistent assembly quality.

Advantages over Flat Substrates

Compared to conventional flat substrates, the six-boss elevated structure prevents full-surface contact with the carrier plate. This eliminates coating blind spots, reduces workpiece adhesion and sticking, and significantly improves production yield. Combined with fused quartz's superior resistance to process chemicals and high temperatures, this substrate delivers reliable performance for demanding semiconductor and optical manufacturing environments.