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High Frequency HDI PCB Prototype 1-32 Layer Manufacturing Service with 1oz-4oz Copper Options
High Frequency HDI PCB Prototype 1-32 Layer Manufacturing Service with 1oz-4oz Copper Options
High Frequency HDI PCB Prototype 1-32 Layer Manufacturing Service with 1oz-4oz Copper Options
High Frequency HDI PCB Prototype 1-32 Layer Manufacturing Service with 1oz-4oz Copper Options
Specifications
Packaging Details :
Anti-static + bubble wrap + cardboard box
Material Type :
FR-4.Aluminum.Copper .Ceramic .Flexible Boards.Rigid-Flex Board
Delivery Time :
2H-7DAY
Material :
FR-4
Type :
High Frequency RF
Payment Terms :
Western Union,T/T
Layer Count :
1-32 Layers
Certification :
UL
Outer Copper Weight :
1oz-4oz
Min. Drill Hole :
0.15mm
Surface Finish :
HASL/Lead free HASL/ENIG/OSP
Price :
$10
MOQ :
1
Supply Ability :
1000000PCS
Technology :
HDI with Micro-Vias
Brand Name :
QHPCBA
Place of Origin :
Shenzhen, China
Model Number :
QH-1157
Description

0.15mm HDI High Frequency Mixed Pressure Prototype Board PCB 1oz-4oz

Product Overview

We specialize in high-precision HDI high-frequency mixed-pressure PCBs. Adopting mixed lamination technology of high-frequency dielectric material and standard FR4 material, combined with HDI microvia stacked structure, the board balances high-frequency signal transmission performance and high-density wiring advantages. It solves the pa-in points of high cost of pure high-frequency boards and poor high-frequency performance of ordinary PCBs. It supports quick prototyping and small-batch mass production for communication and high-speed electronic equipment.

Core Advantages
  • Mixed lamination structure with low dielectric constant and low loss, stable high-frequency signal transmission and strong anti-interference ability
  • HDI microvia technology with staggered blind and buried vias, high wiring density and high board utilization
  • Accurate impedance control to meet signal integrity requirements of high-speed and high-frequency equipment
  • Higher cost performance than full high-frequency boards, greatly reducing R&D and mass production costs
  • 24–48 hours quick sample service in Shenzhen factory, supporting multi-layer precision mixed lamination
Applications

5G communication modules, RF radio frequency equipment, microwave radar, UAV control systems, high-speed servers, industrial high-frequency sensing equipment, smart home communication mainboards.

Process Capability

Support 1-2-1, 2-3-2 stacked HDI structure, multi-layer mixed pressure, impedance control, ENIG, silver immersion, HASL and other surface finishes, compliant with IPC Class 2/3 standards.

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High Frequency HDI PCB Prototype 1-32 Layer Manufacturing Service with 1oz-4oz Copper Options

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Product Detail
Packaging Details :
Anti-static + bubble wrap + cardboard box
Material Type :
FR-4.Aluminum.Copper .Ceramic .Flexible Boards.Rigid-Flex Board
Delivery Time :
2H-7DAY
Material :
FR-4
Type :
High Frequency RF
Payment Terms :
Western Union,T/T
Contact Supplier
High Frequency HDI PCB Prototype 1-32 Layer Manufacturing Service with 1oz-4oz Copper Options
High Frequency HDI PCB Prototype 1-32 Layer Manufacturing Service with 1oz-4oz Copper Options

Shenzhen Jingchengjie Technology Co., Ltd.

Verified Supplier
1 Years
guangdong, shenzhen
Business Type :
Manufacturer, Trading Company
Main Products :
One Stop PCBA, PCB Prototype, SMT Stencil
Total Annual :
>1000000
Employee Number :
>100
Certification Level :
Verified Supplier
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