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High Density HDI Multi Layer Embedded Control Board Gold Finish
High Density HDI Multi Layer Embedded Control Board Gold Finish
High Density HDI Multi Layer Embedded Control Board Gold Finish
High Density HDI Multi Layer Embedded Control Board Gold Finish
Specifications
Place of Origin :
china
Supply Ability :
1000000PCS
Application :
AI Edge Computing, Medical Imaging, Industrial Tablet
Delivery Time :
6day
Model Number :
QHPCBA26511
Material :
High-TG FR-4 (Halogen Free)
Certification :
ISO 9001
Layer Count :
8-12 Layers HDI (Blind/Buried Vias)
BGA Pitch / BGA :
Min 0.35mm Pitch
Payment Terms :
Western Union,T/T
MOQ :
1
Surface Finish :
ENIG (Electroless Nickel Immersion Gold)
Packaging Details :
Vacuum packaging+Cardboard box
Brand Name :
QHPCBA
Price :
$10
Min Trace/Space :
2.5mil
Description

High-Density HDI Multi-Layer Embedded Control Board - Gold Finish

Complexity: This board features a high-density SoC/FPGA BGA design, surrounded by 0201 passive components, requiring extreme precision in SMT placement.

Interconnect Technology: Utilizes advanced HDI (High-Density Interconnect) with blind and buried vias to manage complex signal routing in a compact form factor.

Interface Rich: Integrated with multiple FPC/FFC connectors (J10-J26), SIM/MicroSD slots, and high-speed display interfaces.

Feature QHPCBA (Factory‑Direct) Generic Platforms
Response Time Direct Engineering Review 12‑24h Customer Support Ticket
Production Speed 8 Hours (SMT) 3‑7 Days (Standard)
Middleman Markup 0% (Factory Pricing) Platform Commission Fees
DFM Feedback Active & Collaborative Automated "Reject"
Facility Access Visit Our Shenzhen Factory Virtual/Office Address
Manufacturing Excellence at QHPCBA

Our factory specializes in the rapid prototyping of complex HDI boards, ensuring structural integrity and signal fidelity.

Ultra-Precision Stencil (2-Hour): Custom laser-cut stencils with nano-coating options for perfect BGA solder release.

Rapid PCB Fabrication (24-48H): Specialized supply chain for multi-layer HDI prototyping.

Expert SMT Assembly (8-Hour): Equipped with high-speed Yamaha/Pana-sonic mounters capable of 01005 component placement and X-Ray BGA inspection.

Quality Control

  • X-Ray Inspection: 100% inspection for BGA & QFN internal soldering.

  • AOI Testing: Full automated optical inspection for all SMT components.

  • Impedance Control: Strict tolerance matching for high-speed differential pairs.

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High Density HDI Multi Layer Embedded Control Board Gold Finish

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Product Detail
Place of Origin :
china
Supply Ability :
1000000PCS
Application :
AI Edge Computing, Medical Imaging, Industrial Tablet
Delivery Time :
6day
Model Number :
QHPCBA26511
Material :
High-TG FR-4 (Halogen Free)
Contact Supplier
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High Density HDI Multi Layer Embedded Control Board Gold Finish
High Density HDI Multi Layer Embedded Control Board Gold Finish

Shenzhen Jingchengjie Technology Co., Ltd.

Verified Supplier
1 Years
guangdong, shenzhen
Business Type :
Manufacturer, Trading Company
Main Products :
One Stop PCBA, PCB Prototype, SMT Stencil
Total Annual :
>1000000
Employee Number :
>100
Certification Level :
Verified Supplier
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