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LCB3566 RK3566 Android System On Module With SATA Interface 2 x SATA3.0
LCB3566 RK3566 Android System On Module With SATA Interface 2 x SATA3.0
LCB3566 RK3566 Android System On Module With SATA Interface 2 x SATA3.0
LCB3566 RK3566 Android System On Module With SATA Interface 2 x SATA3.0
Specifications
Brand Name :
Neardi
Model Number :
LCB3566
Place of Origin :
Shanghai, China
MOQ :
1 piece
Price :
Negotiable
Payment Terms :
L/C,D/A,D/P,T/T
Supply Ability :
10000/pieces/mon
Delivery Time :
7 days
Packaging Details :
33.5×19×9 cm
SoC :
RK3566
Supplier Type :
OEM/ODM
CPU :
4 * Cortex-A55
GPU :
ARM G52 2EE
NPU :
The Build-in NPU Supports INT8/INT16/FP16/BFP16 MAC Hybrid Operation.
VPU :
4K/1080P
DDR :
LPDDR4/LPDDR4X, 1GB/2GB/4GB/8GB (Optional)
EMMC :
EMMC 5.1, 8GB/16GB/32GB/64GB/128GB (Optional)
Working Temperature :
Enterprise Grade: -20°C To 70°C Industrial Grade: -40°C To 85°C
PCB Interface :
B2B, 240 Pin
Description

LCB3566 RK3566 Android System On Module With SATA Interface 2 x SATA3.0

Product Description:

The LCB3566 is a high-performance core module built on the Rockchip RK3566 platform, designed with precision to meet demanding embedded applications. With a compact 62mm × 40mm form factor, it connects seamlessly to a baseboard using two Amphenol 0.8mm pitch dual-row 120Pin board-to-board connectors, secured by four M2 screws for enhanced stability, reliability, and ease of installation and maintenance.


This module integrates a CPU, DDR, eMMC, and PMU. The RK3566 processor ensures excellent computing performance, while the LPDDR4 memory, available in 2GB, 4GB, and 8GB configurations, delivers low power consumption and high-frequency operation. The eMMC storage supports the high-speed eMMC 5.1 standard, ranging from 4GB to 128GB. For power management, the LCB3566 utilizes the RK809 along with multiple DC-DC and LDO components, enabling Dynamic Voltage and Frequency Scaling (DVFS) for optimized power efficiency.


Engineered with a modular approach, the LCB3566 exposes all essential CPU functional pins, extensively tested and validated for reliability. This architecture streamlines product development, significantly reducing time-to-market, lowering development costs, and enhancing overall business efficiency.


Key Features:

• Compact and high-performance system-on-module

• Optimized for embedded applications

• Energy-efficient with low power consumption

• Scalable memory and storage options

• Ideal for rapid prototyping and mass production

• Seamless integration with diverse hardware components

• Stable and reliable operation

• Supports multiple operating systems and platforms

• High-speed connectivity for advanced applications

• Cost-effective solution for industrial deployment

Technical Parameters:

Function Description
CPU RK3566, 22nm process, quad-core 64-bit Cortex-A55
GPU ARM G52 2EE, OpenGL ES 1.1/2.0/3.2, OpenCL 2.0, Vulkan 1.1, high quality 2D Graphics Engine build in
NPU The build-in NPU supports INT8/INT16/FP16/BFP16 MAC hybrid operation.
VPU 4KP60 H.265/H.264/VP9 video decoder
1080P60 H.264/H.265 video encoder
8M ISP
DDR LPDDR4/LPDDR4X RAM is available in optional capacities of 1GB, 2GB, 4GB, or 8GB.
eMMC eMMC 5.1 storage, with options for 8GB/16GB/32GB/64GB/128GB (Optional).
PMU RK806
OS Android / Ubuntu / Buildroot / Debian
Camera Interface Compatible with the MIPI Alliance Interface specification v1.2
Up to 4 data lanes, 2.5Gbps maximum data rate per lane
One interface with 1 clock lane and 4 data lanes
Two interfaces, each with 1 clock lane and 2 data lanes
Support up to 16bit DVP interface (digital parallel input)
Support ISP block(Image Signal Processor)
Display Interface RGB/ BT656/BT1120/ MIPI_DSI_V1.2/ LVDS/ HDMI2.0/Edp1.3/ EBC
Support dual screen simultaneous
HDR10/HDR HLG/ HDR2SDR/SDR2HDR
3D-LUT/P2I/CSC/BCSH/DITHER/CABC/GAMMA/COLORBAR
USB Interface 1 x USB3.0 HOST, 3 x USB2.0 HOST, 1 x USB2.0 OTG
PCIe Interface 1x PCIe2.1 with 1 lane
SATA Interface 2 x SATA3.0
Audio Interface I2S0 with 8 channel TX and RX
I2S1 with 8 channel TX and RX
I2S2/I2S3 with 2 channel TX and RX
PDM with 8channel
TDM supports up to 8 channels for TX and 8 channels RX path
Connectivity Compatible with SDIO 3.0 protocol
GMAC 10/100/1000M Ethernet Controller
Four on-chip SPI controllers
Ten on-chip UART controllers inside
Six on-chip I2C controllers
Smart Card with ISO-7816
Sixteen on-chip PWMs(PWM0~PWM15) with interrupt-based operation
Multiple groups of GPIO
4 single-ended input channels SARADC with 10bits resolution up to 1MS/s
sampling rate
Operating temperature Enterprise Grade: -20°C to 70°C
Industrial Grade: -40°C to 85°C
PCB interface B2B,240Pin
PCB layers 8 layers
PCB size L* W *H(mm):62 *40 * 8.3(PCB thickness 1.6mm)

Support and Services:

Our System On Module (SoM) product comes with comprehensive technical support and services to ensure seamless integration and deployment. We provide:

  • Extensive documentation and resources
  • Technical consultation and support from our expert engineers
  • Customization services to meet specific requirements
  • Testing and validation services for quality assurance
  • Training and workshops for efficient use and maintenance

Our goal is to provide our customers with the necessary support and services to ensure successful implementation and operation of our SoM product.

Packing and Shipping:

Product Packaging for System On Module (SoM):

  • The SoM will be securely packaged in an anti-static bag to prevent any damage from static electricity.
  • The anti-static bag will be placed in a protective foam tray to prevent any physical damage during shipping.
  • The foam tray will be placed in a cardboard box with additional padding to provide extra protection during shipping.
  • The cardboard box will be labeled with the product name, SKU number, and a barcode for easy tracking.

Shipping Information:

  • The SoM will be shipped via a reputable courier service, such as UPS or FedEx.
  • Shipping costs will be calculated based on the destination and weight of the package.
  • Customers will receive a tracking number and estimated delivery date once the package has been shipped.
  • Please allow 2-3 business days for processing and handling before the package is shipped.

FAQ:

Q: Where is this System On Module produced?

A: This System On Module is produced in Shanghai, China.

Q: What is the Brand Name of this System On Module?

A: The Brand Name of this System On Module is Neardi.

Q: What is the Minimum Order Quantity for this product?

A: The Minimum Order Quantity for this product is 1 piece.

Q: What are the Payment Terms for this product?

A: The Payment Terms for this product are L/C, D/A, D/P, T/T.

Q: What is the Supply Ability of this product?

A: The Supply Ability of this product is 10000/pieces/mon.

Q: What is the Delivery Time for this product?

A: The Delivery Time for this product is 7 days.

Q: What are the Packaging Details for this product?

A: The Packaging Details for this product are 33.5×19×9 cm.

Q: Is the price of this product negotiable?

A: Yes, the price of this product is negotiable.

LCB3566 RK3566 Android System On Module With SATA Interface 2 x SATA3.0


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LCB3566 RK3566 Android System On Module With SATA Interface 2 x SATA3.0

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Product Detail
Brand Name :
Neardi
Model Number :
LCB3566
Place of Origin :
Shanghai, China
MOQ :
1 piece
Price :
Negotiable
Payment Terms :
L/C,D/A,D/P,T/T
Contact Supplier
LCB3566 RK3566 Android System On Module With SATA Interface 2 x SATA3.0
LCB3566 RK3566 Android System On Module With SATA Interface 2 x SATA3.0

Shanghai Neardi Technology Co., Ltd.

Verified Supplier
1 Years
shanghai, shanghai
Since 2014
Business Type :
Manufacturer, Exporter
Main Products :
System On Module SoM, Single Board Computer, Embedded Computer
Total Annual :
100000-1000000
Employee Number :
20~100
Certification Level :
Verified Supplier
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