Double-sided tin-plated PCB, headphone board ear plate enquipment
Double-sided hot air solder leveling (HASL) PCB is a type of printed circuit board where both sides of the substrate are treated with the hot air solder leveling process, featuring practical performance and wide adaptability. Its core characteristics are as follows: The surface treatment involves uniformly covering the copper surface with molten tin-lead alloy (or lead-free tin alloy), which is then leveled by hot air to form a flat, bright tin layer with moderate thickness and strong adhesion. This process endows the board with excellent solderability, ensuring good wetting of the solder during component welding, reducing the risk of cold solder joints. Moreover, the tin layer allows for multiple rework soldering, making it suitable for mass assembly and later maintenance needs. Meanwhile, the tin layer has certain oxidation resistance and protective capabilities, which can protect the copper surface from environmental corrosion, extend the storage and service life of the board, and is particularly suitable for general industrial environments such as humid and dusty conditions.
Core Characteristics:
| Feature | Description |
| Layer Structure | Conductive copper layers on both top and bottom sides of the insulating substrate |
| Interconnection | Plated through-holes (vias) connect circuits between the two layers |
| Wiring Capacity | Double-sided routing enables higher wiring density and complex circuit layouts |
Key Advantages: