Double-sided blue oil OSP process

Double-sided blue oil OSP process, also known as double-sided printed circuit board, is a printed circuit board (PCB) with two-sided circuit connections. In this kind of PCB, the electronic components and circuit layout can be arranged on both sides of the PCB respectively, and the electrical connection of the circuits on both sides is achieved through vias (Vias). This structure greatly increases the functional density of the circuit board, allowing it to implement more circuit connections in a relatively small area.

Key Takeaways:

1. Space Efficiency – Doubles usable area without increasing board size.
2. Economic Viability – Optimal ROI for prototypes and mid-volume production.
3. Technical Adaptability – Supports mixed-signal designs and high-frequency applications.
4. Manufacturing Maturity – Widely supported by global PCB fabricators with standardized processes.

Core Application Scenarios of Double-Sided PCBs (Simplified Table)

Characteristics of Double-Sided PCBs

1.Characteristics of Double-Sided PCBs:Conductive copper traces are present on both top and bottom surfaces of the substrate (e.g., FR-4), enabling electrical pathways on each side. This doubles the routing space compared to single-sided boards.

2.Plated Through-Holes (PTHs):Essential metalized holes that provide electrical connections between the two copper layers, allowing vertical signal routing and component mounting. This is critical for inter-layer conductivity.

3.Increased Density & Complexity:Supports higher component and trace density by utilizing both sides, accommodating more complex circuits in a compact footprint (e.g., for power supplies or IoT devices), overcoming single-sided limitations

4.Enhanced Design Flexibility:Offers greater routing freedom, such as crossing traces on opposite layers via PTHs, facilitating intricate layouts for applications like automotive electronics or industrial controls.

5.Dual-Side Component Mounting:Allows SMD (Surface Mount Devices) and through-hole components to be placed and soldered on either or both sides, optimizing space efficiency and assembly options.

6.Standard Finishes:Typically includes solder mask (e.g., green epoxy for insulation and solder protection) and silkscreen (for markings like labels and logos) applied to one or both sides, enhancing durability and usability.