4-layer HDI flexible PCB

Advantages of Miniaturization design PCB:

• Miniaturization design
• Higher circuit density
• Better electrical performance
• Improve heat dissipation performance

product Description:

4-layer HDI flexible PCB is a PCB that achieves higher circuit density by using thinner lines, smaller apertures and denser wiring design. This PCB technology can achieve more circuit connections in a limited space by adopting more advanced manufacturing processes and design technologies, and is widely used in mobile phones, tablets, computers, equipment, automobiles, electronics and other medical fields.

HDI PCB(High-Density Interconnect Printed Circuit Board)

product Features:

• High-density interconnection
• Micro via
• Blind and buried hole design
• Multi-level design
• Fine lines and fine pitch
• Excellent electrical performance
• Highly integrated

Manufacturing process:

• Multilayer wiring: HDI PCBs typically employ a multilayer design, connecting different circuit layers through blind and buried vias. Interconnection each layer is achieved through microvias, blind vias, or buried vias, which enhances the density and integration of the circuit board.
• Blind and buried via design: Blind vias are holes that connect only the outer and inner layers, while buried vias are holes that connect the inner layers. The use of these holes can further reduce the volume of the circuit board and increase the wiring density.
• Surface treatment and assembly: The surface treatment of HDI PCBs requires higher precision and reliability. Common surface treatments include gold plating, silver pl, OSP (Organic Metal Surface Treatment), etc. In addition, the assembly process of HDI PCBs usually requires fine welding technology to ensure the close connection between and the circuit board.
• High-precision process: In the manufacturing process of HDI PCB, high-precision etching technology is required to ensure the correct manufacturing of fine lines precision holes. At the same time, it is necessary to precisely control variables such as current density, temperature, and pressure to ensure the consistency and high performance of the.