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Multi Layer Structure High Density PCB Board 8 Layer HD PCB For Precise Communication
Multi Layer Structure High Density PCB Board 8 Layer HD PCB For Precise Communication
Multi Layer Structure High Density PCB Board 8 Layer HD PCB For Precise Communication
Multi Layer Structure High Density PCB Board 8 Layer HD PCB For Precise Communication
Specifications
Brand Name :
High Density PCB
Place Of Origin :
China
Model Number :
Varies by goods condition
Certification :
ROHS, CE
MOQ :
5 square meters
Price :
NA
Payment Terms :
T/T,Western Union
Supply Ability :
3000㎡
Delivery Time :
15-17 work days
Min. Solder Mask Clearance :
0.1mm
Count :
8 Layer
Cooper Thickness :
2oz Out Layer , 1oz Inner Layer
Surface Finish :
HASL, ENIG, OSP
Layer Count :
1-30
Minimum Via Dia :
0.2mm
Impedance Control :
±10%
Board Thickness :
0.2-5mm
Description

Product Description:

High Density PCBs (Printed Circuit Boards), or HDPCBs, are advanced circuit boards characterized by high component density, fine line widths/spacings (typically ≤ 0.1mm), small via sizes (e.g., microvias ≤ 0.15mm), and multi-layer structures. Their core advantage lies in enabling miniaturization, high performance, and reliabilityof electronic devices—making them indispensable in industries where space constraints, signal integrity, and functional complexity are critical.

Features:

1.Ultra-fine traces: Line widths/spacings ≤ 0.1mm (even down to 0.03mm), fitting more conductive paths in limited space.
2. Microvias: Tiny holes (≤0.15mm diameter) in blind/buried/stacked designs, connecting layers without wasting surface area.
3. Multi-layer structure: 8–40+ layers (vs. 2–4 for traditional PCBs) to isolate signals/power and integrate complex circuits.
4. High component density: ≥100 components per square inch, enabling mini devices (e.g., smartwatches) with rich functions.
5. Specialized materials: High-Tg FR-4 (heat-resistant), polyimide (flexible), or PTFE (low signal loss) for harsh environments/high frequencies.
6. Strict precision: Tight tolerances (e.g., ±5% line width error, ≤0.01mm layer alignment) to avoid defects in fine structures.
7. Advanced component compatibility: Supports fine-pitch BGA, CSP, and PoP packages, maximizing vertical/horizontal space use.

Applications:

Sector Use Cases HDI Advantage
Consumer Smartphones, AR/VR headsets 50% size reduction vs. conventional PCBs
AI/Computing GPU accelerators, server GPUs Supports 25 Tbps/mm² interconnect
Medical Endoscopic capsules, hearing aids Reliability in 50 GHz) for signal integrity validation.

HD PCB development trend in 2025

1. 3D Heterogeneous Integration

  • Chiplet Ecosystems: Hybrid bonding (e.g., TSMC’s CoWoS-L) with 8µm line/space for NVIDIA/AMD GPU substrates.
  • Silicon Interposers: TSV density >50k vias/mm², slashing signal delay by 30% in AI servers.
  • Embedded Actives: Bare dies integrated into PCB layers (e.g., Medtronic’s neural implants).

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Multi Layer Structure High Density PCB Board 8 Layer HD PCB For Precise Communication

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Product Detail
Brand Name :
High Density PCB
Place Of Origin :
China
Model Number :
Varies by goods condition
Certification :
ROHS, CE
MOQ :
5 square meters
Price :
NA
Contact Supplier
Multi Layer Structure High Density PCB Board 8 Layer HD PCB For Precise Communication
Multi Layer Structure High Density PCB Board 8 Layer HD PCB For Precise Communication

Dongguan Xingqiang Circuit Board Technology Co., Ltd.

Verified Supplier
1 Years
guangdong, dongguan
Since 1995
Business Type :
Manufacturer, Trading Company
Main Products :
Multilayer PCB Board, Flexible PCB Board, Double Sided PCB
Total Annual :
84,094,800-84,094,800
Employee Number :
500~800
Certification Level :
Verified Supplier
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