What is BT Printed Circuit Board?

BT resin PCB (BT Resin PCB) refers to a thin printed circuit board using BT resin (Bismaleimide-Triazine) as a compensation material. BT resin is a high-performance epoxy resin composite material with excellent thermal stability, electrical properties and mechanical strength. It is widely recognized in circuit boards that require high-temperature stability and high performance. BT thin sheet PCB is characterized by its thin design, heat transfer performance and high-density thin profile capability, making it suitable for high-end electronic equipment, especially in applications that require thinness and high performance.

Higher Reliability & Longer Lifespan for Your Critical Equipment:

• Excellent high-temperature stability and thermal resistance
• Low signal loss, stable electrical performance
• Ideal for high-density circuit wiring
• Supports slim and lightweight design
• Strong chemical and corrosion resistance
• High reliability & long-term durability

Why Choose XingQiang PCB Technology?
✔ With 30 years of professional experience, XingQiang PCB Technology specializes in high-quality rigid, flex, and rigid-flex PCB manufacturing, delivering stable and reliable solutions for industrial and high-end applications.
✔ Fully certified with ISO 9001, RoHS, and IATF/TS16949, ensuring consistent quality, safety, and compliance for global markets.
✔ We provide standard FR-4 PCB, high-performance BT PCB, multilayer PCB, and industrial control circuit boards to meet your specific requirements.
✔ Dedicated professional engineering support covers DFM analysis, impedance simulation, design optimization, and full technical consultation, helping you reduce risks and improve product reliability.
✔ Efficient global delivery service through DHL, FedEx, UPS and other express carriers, with fast and safe shipments to the USA, Germany, UK, Japan, Australia, and worldwide.

Quality‑Assured Production to Secure Your Product Performance:

1.DFM & File Check – Review Gerber files and design feasibility.
2. Material Prep – Cut BT/FR‑4 core materials.
3. Inner Layer Circuit – Expose, etch inner layers.
4. Lamination – Bond layers into multilayer board.
5. Drilling & Plating – Drill holes, plate copper for conduction.
6. Outer Layer Circuit – Etch outer traces.
7. Solder Mask & Surface Finish – Apply solder mask and surface treatment (ENIG/HASL/OSP).
8. Silk Screen & Profiling – Print labels, cut to shape.
9. Electrical Test & Inspection – Test for open/short, final QC.
10. Packing & Shipping – Package finished boards.