4-layer HASL rigid-flex PCB

product Description:

The 4-layer lead-free HASL (Hot Air Solder Leveling) flex-rigid PCB merges structural adaptability with robust solder performance, engineered for reliable operation in demanding electronic systems.Constructed with a 4-layer configuration, it integrates rigid FR-4 substrates for mechanical robustness and flexible polyimide (PI) layers for superior bending capability, enabling seamless 3D integration in compact assemblies. Its standout feature is the lead-free HAL surface finish—a RoHS-compliant process that deposits a uniform tin-lead alloy (or tin-silver-copper for lead-free variants) via hot air leveling, ensuring excellent solderability, enhanced wear resistance, and strong adhesion to copper traces..

product Features:

• Rigidity and flexibility combined
• Space saving
• High-density wiring
• Good seismic and anti-interference performance
• Improve the reliability of the system
• Design flexibility

Manufacturing process:

• The 4-layer lead-free HASL (Hot Air Solder Leveling) flex-rigid PCB merges structural adaptability with robust solder performance, engineered for reliable operation in demanding electronic systems.
• PCB lamination: The manufacturing of rigid-flex PCBs requires the lamination of rigid and flexible parts, which usually involves precise hot pressing and bonding to combine different material circuit layers into a complete PCB.
• Etching and hole processing: Photolithography and etching are performed on the laminated PCB to form the desired circuit pattern, and hole processing is out for component mounting and interconnection between different circuit layers.
• Surface treatment: Surface treatment processes (such as gold plating, tin plating, OSP, etc.) are used to protect the surface of the circuit, ensuring its good solderability and anti-oxidation capability.
• Assembly and testing: After completing the circuit board, perform component placement or plug-in welding, and conduct electrical testing to ensure that the circuit functions normally and the design requirements.