Say goodbye to the cumbersome combination of traditional "rigid board + FPC + connector." Our immersion gold rigid-flex PCBs seamlessly combine FR4 rigid substrates with polyimide (PI) flexible substrates. They support three-dimensional bending and folding for easy installation, effortlessly adapting to the compact layouts of ultra-small devices such as smartwatches, medical endoscopes, and automotive sensors. This reduces the number of connection points by more than 50%, resulting in a 30% reduction in failure rate.
• Type: Rigid-Flex (FR4 + PI)
• Layers: 1–30L
• Finish: ENIG/OSP/HASL
• Line/Spacing: 3/3 mil typical
• Min Hole: 0.1 mm typical
• Impedance: ±5%
• Certifications: RoHS / UL
Send us your:
1. Gerber files (RS-274X)
2. BOM (if PCBA needed)
3. Impedance requirements & stack-up (if available)
4.Test requirements (TDR, network analyzer, etc.)
We’ll reply within 24 hours with a free quote, DFM report, and material recommendation.

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