High-Accuracy Dual-Valve Dam & Fill Dispenser for Wire Bonding

The GS600DD is an advanced dual-valve dispensing solution crafted for the modern semiconductor packaging industry. Designed as a robust cabinet-style floor-standing unit, this system provides manufacturers with the flexibility, speed, and high accuracy demanded by today’s PCBA and high-end semiconductor assembly lines.

This floor-standing system supports dual-valve synchronous interpolation and dual-valve asynchronous modes, so manufacturers can run two dispensing processes in parallel or use different glue flow rates as needed. With a universal cabinet-type structure, it is easy to maintain, simple to upgrade, and can be redeployed across multiple workstations without costly downtime.

Key Advantages

• Flexible dual-valve design: Handle multiple glue tasks at once — faster production, more efficient use of materials.

• Automatic Maintenance: The built-in laser height sensor, residual glue cleaning cup, and automatic low-level warning minimize downtime and help sustain high OEE rates.

• Flexible Materials: From solder paste and UV adhesives to conductive pastes, the GS600DD supports diverse media for dam & fill, edge sealing, and component encapsulation.

• Stable Operation: FFU air purification, UPS backup, and real-time pressure programming keep glue flow consistent, even during unexpected line changes.

Application Fields

✓ FCBGA Coating Application
✓ Wire Bonding Coating Application

Core Modules

Double-Valve Synchronization (with Interpolation) Module

Automatic dispensing position correction separately for double valves

Simultaneous operation of double valves to improve the production efficiency

Piezoelectric Jetting System

Suitable for filling or coating of low-viscosity adhesives such as Fill

Screw Dispensing System

Suitable for coating of high-viscosity adhesives such as Dam and Tim

Glue Tank Scanning Module

Automatic reading of tank QR code information to prevent poor operation caused by glue mixing / expired glue

Visual System

Positioning and detection functions
Inspection before operation to avoid defective incoming materials

Inspection after operation to prevent batch defects

Platform-Type Loading & Unloading System

Automatic sorting of feeding sequence
Completion of operation within Plasma time limit

Friendly human-machine interface design

FAQ

Q1: What makes the GS600DD suitable for dam & fill applications?
A: The dual-valve system allows the dam to be formed first with precise edge control, followed by fill dispensing — both can be fine-tuned for flow, height, and path accuracy.

Q2: Can the system handle different adhesive types?
A: Yes! From solder paste to UV-curable resins and conductive adhesives, the GS600DD adapts easily with programmable pressure and valve controls.

Q3: How does the system minimize glue waste or overflow?
A: Integrated laser sensors, machine vision, and real-time glue path calculation help maintain tight glue volumes and avoid spillover, crucial for BGA and fine-pitch areas.

About Mingseal

Mingseal is a trusted partner for global manufacturers seeking next-level precision in dispensing, jetting, and coating processes. From wafer-level underfill to high-end system-in-package bonding, Mingseal continues to deliver innovative solutions that help semiconductor producers achieve higher yields, lower defect rates, and better ROI.

Explore more about our full portfolio at Mingseal