| PCB Assembly Capability | |
| Item | Capability |
| Advantages | ----Professional Surface-mounting and Through-hole soldering technology |
| ----Various sizes like 1206,0805,0603 components | |
| ----ICT(In Circuit Test),FCT(Functional Circuit Test) | |
| ----PCB Assembly With UL,CE,FCC,Rohs Approval | |
| ----Nitrogen gas reflow soldering technology for | |
| ----High Standard SMT&Solder Assembly Line | |
| ----High density interconnected board placement technology capacity. | |
| Components | Passive Down to 0201 size |
| BGA and VFBGA | |
| Leadless Chip Carriers/CSP | |
| Double-sided SMT Assembly | |
| Fine Pitch to 0.8mils | |
| BGA Repair and Reball | |
| Part Removal and Replacement | |
| Quantity | Prototype & Low Volume PCB Assembly,from 1 Board to 250, or up to 1000 and customized |
| Type of | Thru-hole |
| Solder Type | Water Soluble Solder Paste, Leaded and Lead-Free |
| Bare Board Size | Smallest:0.25*0.25 inches |
| Largest:20*20 inches | |
| File Formate | Gerber files, Pick-N-Place file, Bill of Materials |
| Types of Service | Turn-key,partial turn-key or consignment |
| Component packaging | Cut Tape,Tube,Reels,Loose Parts |
| Turn Time | Same day service to 15 days service |
| Testing | Flying Probe Test,X-ray Inspection AOI Test |
