Development and design of PCBA for PCB multi-layer thick copper plate production and processing
| PCB Item | Production Capacity |
| Layer Counts | 1--20L |
| Base Material | FR4,High-TG FR4,CEM3,aluminum,High Frequency(Rogers,Taconic,Aron,PTFE,F4B) |
| Material Thickness(mm) | 0.40, 0.60, 0.80, 1.00, 1.20, 1.50, 1.60, 2.0, 2.4, 3.2 |
| Max board size(mm) | 1200x400mm |
| Board Outline Tolerance | ±0.15mm |
| Board Thickness | 0.4mm--3.2mm |
| Thickness Tolerance | ±8% |
| Minimum line/space | 0.1mm |
| SMD Pitch | 0.3mm |
| Min Hole Size(mechanical) | 0.2mm |
| Min Hole Size(laser hole) | 0.1mm |
| Hole Size Tol (+/-) | PTH:±0.075mm;NPTH: ±0.05mm |
| Surface Finish | HAL,ENIG,Plated Gold,Immersion Gold,OSP |
| Copper Weight | 0.5--6oz |
| Solder mask | Green, Blue, Black, White, Yellow, Red, Matt Green, Matt Black, Matt Blue |
| Acceptable File Format | Gerber file,Powerpcb,CAD,AUTOCAD,ORCAD,P-CAD,CAM-350,CAM2000 |
| Certificate | ROSH,ISO9001,UL |
