n tooth instrument motherboard vacuum cleaner control board production
   
  Essential details
    	- Place of Origin:
  	-  	
Guangdong, China
 	  
   	- Number of Layers:
  	-  	
2 Layer
 	  
   	- Base Material:
  	-  	
FR4
 	  
   	- Copper Thickness:
  	-  	
1oz
 	  
   	- Board Thickness:
  	-  	
1.6mm
 	  
   	- Min. Hole Size:
  	-  	
4mil
 	  
   	- Min. Line Width:
  	-  	
8mil
 	  
   	- Min. Line Spacing:
  	-  	
8mil
 	  
   	- Surface Finishing:
  	-  	
HASL
 	  
   	- Layer:
  	-  	
2-32 Layers
 	  
   	- Thickness:
  	-  	
1.6mm
 	  
   	- Material:
  	-  	
FR4
 	  
   	- Aspect:
  	-  	
30:1(Min. hole:0.4mm)
 	  
   	- Surface Finish:
  	-  	
HASL
 	  
   	- Tolerance of back drill (mm):
  	-  	
±0.05
 	  
   	- Tolerance of press fit holes (mm):
  	-  	
±0.05
 	  
   	- Surface treatment type:
  	-  	
OSP,sterling silver,ENIG
  	 
  	 
  	 
  	 
  	 
  	 
 	  
     
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   	 		 			|  			 Base Material  			 |  			 			 Normal Tg FR4, High Tg FR4, PTFE, Rogers, Low Dk/Df etc.  			 |  		
 		 			|  			 Solder Mask Color  			 |  			 			 Green, Red, Blue, White, Yellow, Purple, Black  			 |  		
 		 			|  			 Legend Color  			 |  			 			 white, yellow, black, red  			 |  		
 		 			|  			 Surface treatment type  			 |  			 			 ENIG, Immersion tin, HAF, HAF LF, OSP, flash gold, gold finger, sterling silver  			 |  		
 		 			|  			 Max. layer-up(L)  			 |  			 			 50  			 |  		
 		 			|  			 Max. unit size (mm)  			 |  			 			 620*813 (24"*32")  			 |  		
 		 			|  			 Max. working panel size (mm)  			 |  			 			 620*900 (24"x35.4")  			 |  		
 		 			|  			 Max. board thickness (mm)  			 |  			 			 12  			 |  		
 		 			|  			 Min. board thickness(mm)  			 |  			 			 0.3  			 |  		
 		 			|  			 Board thickness tolerance (mm)  			 |  			 			 T<1.0mm: +/-0.1mm; T≥1.0mm: +/-10%  			 |  		
 		 			|  			 Registration tolerance (mm)  			 |  			 			 +/-0.10  			 |  		
 		 			|  			 Min. mechanical drilling hole diameter (mm)  			 |  			 			 0.15  			 |  		
 		 			|  			 Min. laser drilling hole diameter(mm)  			 |  			 			 0.075  			 |  		
 		 			|  			 Max. aspect(through hole)  			 |  			 			 15:1  			 |  		
 		 			|  			 Max. aspect(micro-via)  			 |  			 			 1.3:1  			 |  		
 	 
  