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High Density Interconnect HDI PCBA for Miniaturized Electronics and Advanced Packaging
High Density Interconnect HDI PCBA for Miniaturized Electronics and Advanced Packaging
Specifications
Placement Accuracy :
±0.05mm
Place of Origin :
China
SMD Configuration :
Single-sided / Double-sided
Certification :
ISO9001
Assembly Technology :
Surface Mount Technology (SMT)
Price :
negotiate
SMT Component Types :
ICs, resistors, capacitors, BGAs
Delivery Time :
15-30 Days
Brand Name :
Jiaqing Circuit
Payment Terms :
L/C,D/A,D/P,T/T
Description

This High Density Interconnect (HDI) PCBA is designed for the most demanding miniaturized electronics applications. Featuring fine lines and spaces (0.075mm/0.075mm), micro-vias (0.1mm diameter), and multiple build-up layers, HDI technology enables significantly higher component density than conventional PCBs. This assembly is ideal for advanced smartphones, AI computing modules, memory modules, and high-performance computing applications. The HDI process incorporates sequential lamination, laser drilling, and advanced plating techniques to achieve the interconnect density required by today's most advanced semiconductor packages.

Technical Specifications
Parameter Specification
Technology High Density Interconnect (HDI)
Minimum Line Width/Space 0.075mm / 0.075mm
Minimum Via Diameter 0.1mm (laser microvia)
Via Types Blind, Buried, Stacked, Staggered
Layer Structure Sequential build-up (1+N+1, 2+N+2, etc.)
Board Types Rigid, Flex, Rigid-Flex
Component Types Fine-pitch BGAs, CSPs, POPs
Application Areas Smartphones, AI modules, Memory, HPC
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High Density Interconnect HDI PCBA for Miniaturized Electronics and Advanced Packaging

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Product Detail
Placement Accuracy :
±0.05mm
Place of Origin :
China
SMD Configuration :
Single-sided / Double-sided
Certification :
ISO9001
Assembly Technology :
Surface Mount Technology (SMT)
Price :
negotiate
Contact Supplier
High Density Interconnect HDI PCBA for Miniaturized Electronics and Advanced Packaging

Shenzhen Jiaqing Circuit Co., Ltd.

Verified Supplier
1 Years
shenzhen
Since 2012
Business Type :
Manufacturer
Main Products :
IC Substrate Board, PCBA, Standard PCB
Total Annual :
20000000-50000000
Employee Number :
201~300
Certification Level :
Verified Supplier
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