MachineU > China Products > Construction & Real Estate > Plastic Building Materials > Architecture Membrane
TO8 Header Encapsulated Components Transistor Outline Package
TO8 Header Encapsulated Components Transistor Outline Package
TO8 Header Encapsulated Components Transistor Outline Package
TO8 Header Encapsulated Components Transistor Outline Package
TO8 Header Encapsulated Components Transistor Outline Package
TO8 Header Encapsulated Components Transistor Outline Package
TO8 Header Encapsulated Components Transistor Outline Package
TO8 Header Encapsulated Components Transistor Outline Package
Specifications
Brand Name :
JOPTEC
Place of Origin :
HEFEI, CHINA
MOQ :
50 PCS
Payment Terms :
T/T
Supply Ability :
5000000 PCS/Month
Delivery Time :
30 Days
Packaging Details :
Boxes
Welding ring :
HLAgCu28
Cap :
10#Steel
Lead :
4J29(Kovar)
Glass insulator :
BH-G/K
Bottom floor :
4J29(Kovar)
Hermeticity :
≤1*10-3Pa.cm3/s
Shell :
FeNiCo,FeNi42 or CRS
Description
Product name: Sealed enclosure alloy package for circuit
Finish: Fully plating Au or selective plating Au.
Plating coating: Plate and lead plating Ni:4-11.43um,plating Au:1.0-1.3um. Cap plating Ni:4-11.43um.
Product formation: Material Quantity
1. Cap 10#Steel 1
2. Welding ring HLAgCu28 1
3. Lead 1 4J29(Kovar) 1
4. Glass insulator BH-G/K 3
5. Lead 2 4J29(Kovar) 3
6. Bottom floor 4J29(Kovar) 1
Insulation resistance 500V DC resistance between single glass sealed pin and shell is ≥1*1010Ω
Hermeticity Leak rate is ≤1*10-3Pa.cm3/s
Product features: 1. Shell adopt material:FeNiCo,FeNi42 or CRS;
2. The shape of pin is cyclinder and straight,material adopts Kovar.
3. The sealing cap method is percussion welding or tin welding.

4. The rank of pin which cross the bottom of base could be choosen

by customers.
5. The position of ground pin can be choosen by customer.
6. The design of caps need to fit the shell.
7. Customer could choose shell fully plating or pin selective plating.
Product tags

shimano xtr groupset

,

t slot aluminum profiles

,

inspeksi pcb
Send your message to this supplier
Send Now

TO8 Header Encapsulated Components Transistor Outline Package

Ask Latest Price
Product Detail
Brand Name :
JOPTEC
Place of Origin :
HEFEI, CHINA
MOQ :
50 PCS
Payment Terms :
T/T
Supply Ability :
5000000 PCS/Month
Delivery Time :
30 Days
Contact Supplier
TO8 Header Encapsulated Components Transistor Outline Package
TO8 Header Encapsulated Components Transistor Outline Package
TO8 Header Encapsulated Components Transistor Outline Package
TO8 Header Encapsulated Components Transistor Outline Package

JOPTEC LASER CO., LTD

Site Member
6 Years
anhui, hefei
Since 1988
Business Type :
Manufacturer, Distributor/Wholesaler
Main Products :
Hermetically Sealed Electronic Packages, Hermetic High Power Laser Package, Hermetic Optical Fiber Communication Package
Total Annual :
50000000-100000000
Employee Number :
500~1000
Certification Level :
Site Member
Discover similar products
View More

Find Similar Products By Category:

Supplier Homepage Products Transistor Outline Package
MachineU China Products Construction & Real Estate Plastic Building Materials Architecture Membrane
Contact Supplier
Submit Requirement