SPL701 Heat Resistant PLA Resin – Microwave Trays & Hot Fill Containers
Product Description
SPL701 is a medium-high optical purity PLA resin with L-lactide content greater than 98%. This specialized material features a melting point of ≥160°C and is supplied as off-white pellets. It is specifically engineered for producing heat-resistant thermoformed packaging applications including microwaveable trays, hot fill cups, and lids.
Suitable for sheet extrusion, roll forming, fiber production, and 3D printing applications. While offering a lower output rate compared to SPL101, SPL701 provides broader application versatility for demanding thermal environments. Requires drying at 80°C for 4-6 hours before processing.