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Jetson Orin Nano 4GB Module Fan Heat Dissipation Case Enclosure for Next-Gen Robotics
Jetson Orin Nano 4GB Module Fan Heat Dissipation Case Enclosure for Next-Gen Robotics
Jetson Orin Nano 4GB Module Fan Heat Dissipation Case Enclosure for Next-Gen Robotics
Jetson Orin Nano 4GB Module Fan Heat Dissipation Case Enclosure for Next-Gen Robotics
Jetson Orin Nano 4GB Module Fan Heat Dissipation Case Enclosure for Next-Gen Robotics
Jetson Orin Nano 4GB Module Fan Heat Dissipation Case Enclosure for Next-Gen Robotics
Jetson Orin Nano 4GB Module Fan Heat Dissipation Case Enclosure for Next-Gen Robotics
Jetson Orin Nano 4GB Module Fan Heat Dissipation Case Enclosure for Next-Gen Robotics
Jetson Orin Nano 4GB Module Fan Heat Dissipation Case Enclosure for Next-Gen Robotics
Jetson Orin Nano 4GB Module Fan Heat Dissipation Case Enclosure for Next-Gen Robotics
Jetson Orin Nano 4GB Module Fan Heat Dissipation Case Enclosure for Next-Gen Robotics
Jetson Orin Nano 4GB Module Fan Heat Dissipation Case Enclosure for Next-Gen Robotics
Specifications
Place of Origin :
Beijing, China
Brand Name :
Realtimes
Model Number :
RTSS-X306INT-OrinNano4 (5G)
Application :
Intelligent Industry, City, Navigation, Home
Series :
Jetson Orin Nano Series
Features :
Built in Global Version 5G Module
Mounting Type :
High-performance AI Embedded
Description :
Jetson Orin Nano Feiyun Smart Box
Product Name :
Orin Nano RTSS-X306INT-OrinNano4 (5G) Feiyun Smart Box
AI Core :
Jetson Orin Nano 4GB Module
Size :
100mm*71mm*40mm
Work Temperature :
-25 to +50 Celsius Degree
Power :
DC +9V to +36V or OSDK +24V
System :
Ubuntu 20.04
Heat-dissipating Method :
Fan Heat Dissipation
AI Performance :
20 TOPS
OEM/ODM :
Support
Keywords :
Nvidia Jetson Orin Nano
Price :
$1,006.00/pieces 1-9 pieces
Payment Terms :
T/T, Credit Card (Visa/Mastercard), Western Union, PAYPAL, Alibaba Online Link Payment etc...
MOQ :
1 Piece
Description
Products Description
Jetson Orin Nano 4GB Module Fan Heat Dissipation Case Enclosure for Next-Gen Robotics
Jetson Orin Nano 4GB Module Fan Heat Dissipation Case Enclosure for Next-Gen Robotics
Jetson Orin Nano 4GB Module Fan Heat Dissipation Case Enclosure for Next-Gen Robotics
Jetson Orin Nano 4GB Module Fan Heat Dissipation Case Enclosure for Next-Gen Robotics
Jetson Orin Nano 4GB Module Fan Heat Dissipation Case Enclosure for Next-Gen Robotics
Jetson Orin Nano 4GB Module Fan Heat Dissipation Case Enclosure for Next-Gen Robotics
Jetson Orin Nano 4GB Module Fan Heat Dissipation Case Enclosure for Next-Gen Robotics
Jetson Orin Nano 4GB Module Fan Heat Dissipation Case Enclosure for Next-Gen Robotics
Jetson Orin Nano 4GB Module Fan Heat Dissipation Case Enclosure for Next-Gen Robotics
Associated Product (One-stop Purchasing)
Jetson Orin Nano 4GB Module Fan Heat Dissipation Case Enclosure for Next-Gen Robotics
Jetson Orin Nano 4GB Module Fan Heat Dissipation Case Enclosure for Next-Gen Robotics
Why Choose Us
Jetson Orin Nano 4GB Module Fan Heat Dissipation Case Enclosure for Next-Gen Robotics
Cooperation Partner
Jetson Orin Nano 4GB Module Fan Heat Dissipation Case Enclosure for Next-Gen Robotics
Our Factory
Jetson Orin Nano 4GB Module Fan Heat Dissipation Case Enclosure for Next-Gen Robotics
Certification & Exhibition
Jetson Orin Nano 4GB Module Fan Heat Dissipation Case Enclosure for Next-Gen Robotics
Service
Jetson Orin Nano 4GB Module Fan Heat Dissipation Case Enclosure for Next-Gen Robotics
Packaging & Delivery
Jetson Orin Nano 4GB Module Fan Heat Dissipation Case Enclosure for Next-Gen Robotics

Packing
Original Standard Official Factory Encapsulation Technology Packing And Standard Export Carton Package.
(Dustproof packaging: the product is sealed to prevent dust from entering to avoid affecting product quality)
QC
Each of the prducts must be Checked by QC group before shipment.
Shipment
Shipping by DHL, FedEx, UPS, TNT, EMS etc...

Payment
We can accept T/T, Credit Card (Visa/Mastercard), Western Union, PAYPAL, Alibaba Online Link Payment etc...
Also follow customers'requests.
Jetson Orin Nano 4GB Module Fan Heat Dissipation Case Enclosure for Next-Gen Robotics
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Jetson Orin Nano 4GB Module Fan Heat Dissipation Case Enclosure for Next-Gen Robotics

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Product Detail
Place of Origin :
Beijing, China
Brand Name :
Realtimes
Model Number :
RTSS-X306INT-OrinNano4 (5G)
Application :
Intelligent Industry, City, Navigation, Home
Series :
Jetson Orin Nano Series
Features :
Built in Global Version 5G Module
Contact Supplier
Jetson Orin Nano 4GB Module Fan Heat Dissipation Case Enclosure for Next-Gen Robotics
Jetson Orin Nano 4GB Module Fan Heat Dissipation Case Enclosure for Next-Gen Robotics
Jetson Orin Nano 4GB Module Fan Heat Dissipation Case Enclosure for Next-Gen Robotics
Jetson Orin Nano 4GB Module Fan Heat Dissipation Case Enclosure for Next-Gen Robotics
Jetson Orin Nano 4GB Module Fan Heat Dissipation Case Enclosure for Next-Gen Robotics
Jetson Orin Nano 4GB Module Fan Heat Dissipation Case Enclosure for Next-Gen Robotics

Realtimes Beijing Technology Co., Ltd.

Verified Supplier
2 Years
beijing, beijing
Since 2013
Business Type :
Manufacturer, Trading Company
Main Products :
Jetson NANO Series, Jetson Orin Nano Series, Jetson AGX Orin Series
Total Annual :
10000000-50000000
Employee Number :
100~200
Certification Level :
Verified Supplier
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