Product Description: Recycled ESD Custom Jedec Trays Transport BGA Chips High Temperature Customize JEDEC Standard High Temperature Black IC Tray For BGA Chips Character Reference Material: PPE Thickness: 7.62,12.19mm ...learn more
Recycled ESD Custom Jedec Trays Die Transport BGA Chips High Temperature resistance 180°C

Recycled ESD Custom Jedec Trays Die Transport BGA Chips High Temperature resistance 180°C
The capacity is between 2500PCS~3000PCS/per day
$1.35~$2.38(Prices are determined according to different incoterms and quantities）
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Shenzhen Hiner Technology Co.,LTD

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5 Years
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