Specifications
Brand Name :
Hiner-pack
Model Number :
HN23112
Place of Origin :
SHENZHEN CN
Certification :
ISO 9001 ROHS SGS
MOQ :
1000 pcs
Price :
$1.5~$6(Prices are determined according to different incoterms and quantities)
Packaging Details :
70~100pcs/carton(According to the customer demand)
Delivery Time :
Mold:About 25 Days / Product:7~10 Days
Payment Terms :
100% Prepayment
Supply Ability :
2000PCS/Day
Stackable :
Yes
Overall dimension*2 :
322.6x135.9x12.19mm
Custom :
Support
Pocket Size :
12.9*8.5*1.22mm
Matrix :
16x9=144pcs
Clean Class :
General And Ultrasonic Cleaning
Material :
MPPO.PPE.ABS.PEI.IDP
Anti-Static :
Yes
Description

Customizable Jedec Trays For Chip Carriers Protect The Ball Head And Pin Of The Chip

Product Description:

JEDEC trays are an important tool for safely handling semiconductor devices, like integrated circuits (ICs). By providing a secure transport option, JEDEC trays help ensure that semiconductor components arrive at their destination undamaged.

One of the key features of JEDEC trays is their standardized dimensions. These trays are manufactured according to dimensions defined by the JEDEC organization, which means they are compatible across different manufacturers and equipment. Standardized dimensions facilitate easy use and transportation of JEDEC trays.

Features:

Compatibility:

Our product is specifically designed to fit seamlessly with standard handling and testing equipment, including pick-and-place machines. This compatibility significantly streamlines the manufacturing process for our customers, allowing them to optimize their production efficiency.

Reusability:

Our JEDEC trays are built to be durable and lasting, making them an environmentally friendly and cost-effective solution for semiconductor packaging. Many of our trays are designed for multiple uses, which not only benefits the environment but also lowers the overall cost for our customers by reducing the need for frequent replacements.

HN PN. Description External Size/mm Pocket Size/mm Matrix QTY
HN23112 SMLVC16T245MP 322.6x135.9x12.19 12.9*8.5*1.22 16X9=144PCS
TYPE Brand Flatness Resistance Service
BGA IC Hiner-pack MAX 0.76mm 1.0x10e4-1.0x10e11Ω Accept OEM,ODM

Customizable Jedec Trays For Chip Carriers Protect The Ball Head And Pin Of The Chip

Technical Parameters:

The JEDEC TRAY structure and shape are designed to meet international standards. This not only meets the tray's requirements for carrying electronic components and various packaging ICs, but also the requirements of the customer's automatic feeding system. This means that our trays are compatible with automation equipment, allowing for easy loading and efficient work efficiency.

At Hiner-pack, we offer 100% customized JEDEC TRAY solutions that can protect your IC according to the type of chip package. Our website displays our extensive range of JEDEC TRAY designs that fit many types of packaging. We specialize in creating trays that can hold BGA, FBGA, LGAQFN, QFP, PGA, TQFP, LQFP, SoC, and more, providing effective design solutions and wafer-level package protection for your products.

Customizable Jedec Trays For Chip Carriers Protect The Ball Head And Pin Of The Chip

Applications:

Applications of JEDEC Trays

JEDEC trays are highly versatile and are employed in a variety of applications within the semiconductor industry. One of their primary uses is in the manufacturing and assembly of semiconductors. They are also used for testing electronic components to ensure their functionality and quality. Additionally, JEDEC trays are instrumental in the shipping and storage of integrated circuits (ICs) and other delicate devices.

Semiconductor Manufacturing and Assembly

JEDEC trays are a crucial component in the semiconductor manufacturing and assembly process. They provide an efficient and safe means of handling delicate electronic components during production. JEDEC trays are designed to protect the components from damage, and they come in various sizes and configurations to accommodate different component types.

Testing of Electronic Components

JEDEC trays are also used for testing electronic components to ensure their functionality and quality. The trays can be easily transported from one testing station to another without causing damage to the components. Additionally, their design allows for easy access to the components, enabling quick and accurate testing.

Shipping and Storage of Integrated Circuits (ICs) and Other Sensitive Devices

JEDEC trays are widely used in the shipping and storage of integrated circuits (ICs) and other sensitive electronic devices. The trays provide protection against physical damage, electrostatic discharge (ESD), and moisture, ensuring that the components arrive at their destination in excellent condition. The trays are also stackable, making them easy to store and transport in bulk.

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Customizable Jedec Trays For Chip Carriers Protect The Ball Head And Pin Of The Chip

Ask Latest Price
Brand Name :
Hiner-pack
Model Number :
HN23112
Place of Origin :
SHENZHEN CN
Certification :
ISO 9001 ROHS SGS
MOQ :
1000 pcs
Price :
$1.5~$6(Prices are determined according to different incoterms and quantities)
Contact Supplier
Customizable Jedec Trays For Chip Carriers Protect The Ball Head And Pin Of The Chip
Customizable Jedec Trays For Chip Carriers Protect The Ball Head And Pin Of The Chip
Customizable Jedec Trays For Chip Carriers Protect The Ball Head And Pin Of The Chip
Customizable Jedec Trays For Chip Carriers Protect The Ball Head And Pin Of The Chip

Shenzhen Hiner Technology Co.,LTD

Verified Supplier
5 Years
guangdong, shenzhen
Since 2013
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Seller, Other
Total Annual :
5,000,000.00-10,000,000.00
Employee Number :
80~100
Certification Level :
Verified Supplier
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