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Anti-Static High Temperature Cross-Slot Waffle Pack Trays for Semiconductor IC Chips
Anti-Static High Temperature Cross-Slot Waffle Pack Trays for Semiconductor IC Chips
Anti-Static High Temperature Cross-Slot Waffle Pack Trays for Semiconductor IC Chips
Anti-Static High Temperature Cross-Slot Waffle Pack Trays for Semiconductor IC Chips
Anti-Static High Temperature Cross-Slot Waffle Pack Trays for Semiconductor IC Chips
Anti-Static High Temperature Cross-Slot Waffle Pack Trays for Semiconductor IC Chips
Anti-Static High Temperature Cross-Slot Waffle Pack Trays for Semiconductor IC Chips
Anti-Static High Temperature Cross-Slot Waffle Pack Trays for Semiconductor IC Chips
Anti-Static High Temperature Cross-Slot Waffle Pack Trays for Semiconductor IC Chips
Anti-Static High Temperature Cross-Slot Waffle Pack Trays for Semiconductor IC Chips
Specifications
Tray Shape :
Rectangular
Color :
Black
Quality Assurance :
Delivery Guarantee, Reliable Quality
Cavity Size :
6.49x3.86x0.67 mm
Tray Weight :
Varies, Typically Up To 500 Grams Per Cavity
Outline Line Size :
50.8×50.8×3.94 mm
Incoterms :
EXW, FOB, CIF, DDU, DDP
Mold Type :
Injection
MOQ :
1000
Payment Terms :
T/T
Capacity :
5x7=35 PCS
Brand Name :
Hiner-pack
Delivery Time :
10 workdays
Reusable :
Yes
Ic Type :
BGA,QFP,QFN,LGA,PGA
Warpage :
Warpage MAX 0.2mm
Model Number :
HN24174
Price :
$1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities）
Clean Class :
General And Ultrasonic Cleaning
Supply Ability :
2000PCS/Day
Packing Level :
Transport package
Packaging Details :
CARTON, PALLET
Certification :
ROHS, ISO
Place of Origin :
China
Description
Anti-Static High Temperature Cross-Slot Waffle Pack Trays for Semiconductor IC Chips

Deliver stable anti-static protection for IC chips. Withstand up to 125℃ high temperature. Adopt optimized cross-slot structure to lock components tightly. Keep chips safe from dust and contamination. Need reliable semiconductor chip carrying solutions?


Fit semiconductor encapsulation, chip testing, die sorting and wafer processing. Adapt to automated production lines and precision handling workflows. Work smoothly in cleanroom and workshop environments.


Support chip turnover, storage, logistics and vacuum packaging. Offer flexible cavity size, layout and material customization. Create exclusive cross-slot designs for various IC models to meet specific needs.

Key Features/ Benefits
  • Deliver effective ESD anti-static performance
  • Stable high-temperature resistance up to 125℃
  • Suitable for Delicate Fine Pitch ICs
  • Protects delicate fine pitch IC components efficiently
  • Support fully customized cavity sizes and layout designs
  • The factory has ISO certification, and the products comply with the RoHS standard.
Specifications
Brand Hiner-pack
Model HN24174
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 50.8×50.8×3.94 mm
Cavity Size 6.49x3.86x0.67 mm
Matrix QTY 5x7=35 PCS
Warpage MAX 0.2mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
Apply to semiconductor encapsulation, IC performance testing, die sorting and wafer fabrication. Adapt to high-precision electronic manufacturing and cleanroom operations.


Support chip internal turnover, long-term storage, logistics and vacuum packaging. Meet diversified integrated circuit processing and electronic assembly needs.

Customized Services
Accept personalized cross-slot customization. Offer flexible cavity size, layout and material upgrades. Create exclusive designs for diverse IC specifications. Provide one-stop tailored solutions for semiconductor packaging needs.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers
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Anti-Static High Temperature Cross-Slot Waffle Pack Trays for Semiconductor IC Chips

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Product Detail
Tray Shape :
Rectangular
Color :
Black
Quality Assurance :
Delivery Guarantee, Reliable Quality
Cavity Size :
6.49x3.86x0.67 mm
Tray Weight :
Varies, Typically Up To 500 Grams Per Cavity
Outline Line Size :
50.8×50.8×3.94 mm
Contact Supplier
Anti-Static High Temperature Cross-Slot Waffle Pack Trays for Semiconductor IC Chips
Anti-Static High Temperature Cross-Slot Waffle Pack Trays for Semiconductor IC Chips
Anti-Static High Temperature Cross-Slot Waffle Pack Trays for Semiconductor IC Chips
Anti-Static High Temperature Cross-Slot Waffle Pack Trays for Semiconductor IC Chips
Anti-Static High Temperature Cross-Slot Waffle Pack Trays for Semiconductor IC Chips

Shenzhen Hiner Technology Co., Ltd.

Verified Supplier
6 Years
guangdong, shenzhen
Since 2013
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Seller, Other
Main Products :
JEDEC IC Trays, JEDEC Matrix Trays, IC Chip Tray
Total Annual :
5,000,000.00-10,000,000.00
Employee Number :
80~100
Certification Level :
Verified Supplier
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