Custom JEDEC Tray Manufacturer for IC / SiP / MEMS
We provide custom JEDEC tray solutions for advanced semiconductor packaging, including SiP, MEMS and complex IC modules.
Key Features/ Benefits
- Full customization based on chip drawing
- High precision cavity for complex IC structures
- Multiple material options (PEI / MPPO / PPE)
- Fast mold development
Specifications
| Brand |
Hiner-pack |
| Model |
HN24223 |
| Material |
MPPO |
| Package Type |
JEDEC |
| Color |
Black |
| Resistance |
1.0×10⁴ - 1.0×10¹¹ Ω |
| Outline Line Size |
322.6×135.9×7.62 mm |
| Cavity Size |
3x3x0.92 mm |
| Matrix QTY |
14x35=490 PCS |
| Warpage |
MAX 0.76mm |
| Service |
Accept OEM, ODM |
| Custom Pocket Options |
Available |
Applications
JEDEC trays are widely used for IC protection during manufacturing and transport, especially for ESD-sensitive devices
- SiP packaging
- MEMS devices
- Advanced semiconductor modules
Packaging & Shipping/ Services
JEDEC Matrix Trays are packaged in durable, anti-static materials with secure stacking and cushioning inserts. Customized packaging solutions are available upon request. All shipments are tracked and handled by trusted carriers for reliable worldwide delivery.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Why Choose Us:
- Rich experience in JEDEC / IC / waffle pack trays
- In-house mold design capability
- Fast prototype development
- Professional engineering team
- Stable supply for global semiconductor customers