Specifications
Brand Name :
Hiner-pack
Model Number :
HN24220
Certification :
ROHS, ISO
Place of Origin :
China
MOQ :
500 pcs
Price :
$1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
Payment Terms :
T/T
Supply Ability :
2000PCS/Day
Delivery Time :
10 workdays
Packaging Details :
CARTON, PALLET
Tray Weight :
Varies, Typically Up To 500 Grams Per Cavity
Color :
Usually black or dark gray for ESD protection
Quality Assurance :
Delivery Guarantee, Reliable Quality
Cavity Size :
4x5x1.6 mm
Incoterms :
EXW, FOB, CIF, DDU, DDP
Mold Type :
Injection
Reusable :
Yes
Tray Shape :
Rectangular
Clean Class :
General And Ultrasonic Cleaning
Ic Type :
BGA,QFP,QFN,LGA,PGA
Packing Level :
Transport package
Flatness :
Less than 0.76mm
Capacity :
13x28=364 PCS
Description
High Temp ESD JEDEC Tray for AI Chips Packaging
This JEDEC tray is specially designed for high temperature semiconductor processes, such as baking, burn-in, and AI chip packaging.
It ensures dimensional stability and precise positioning during automated handling.
Key Features/ Benefits
  • Up to 180°C high temperature resistant (PEI material)
  • Stable ESD protection (1E4–1E11 Ω)
  • Compatible with ASM / Advantest / YAMAHA machines
  • Free design within 24 hours
  • JEDEC standard footprint
Specifications
Brand Hiner-pack
Model HN24220
Material MPPO
Package Type JEDEC
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 322.6×135.9×7.62 mm
Cavity Size 4x5x1.6 mm
Matrix QTY 13x28=364 PCS
Warpage MAX 0.76mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
These trays are ideal for electronics manufacturing, assembly lines, cleanroom environments, and automated handling systems. Their versatility extends to acrylic tray displays and inventory management applications.
  • AI chips / GPU / ASIC
  • BGA / QFN / IC packaging
  • Burn-in & baking process
  • Production line buffering
Packaging & Shipping/ Services
JEDEC Matrix Trays are packaged in durable, anti-static materials with secure stacking and cushioning inserts. Customized packaging solutions are available upon request. All shipments are tracked and handled by trusted carriers for reliable worldwide delivery.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • 10+ years semiconductor packaging experience
  • In-house mold design capability
  • OEM & ODM customization supported
  • Consistent quality and stable supply
  • Daily capacity: 2000+ pcs
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180°C High Temp JEDEC Tray with ESD Protection for Semiconductor IC Packaging

Ask Latest Price
Brand Name :
Hiner-pack
Model Number :
HN24220
Certification :
ROHS, ISO
Place of Origin :
China
MOQ :
500 pcs
Price :
$1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
Contact Supplier
180°C High Temp JEDEC Tray with ESD Protection for Semiconductor IC Packaging
180°C High Temp JEDEC Tray with ESD Protection for Semiconductor IC Packaging
180°C High Temp JEDEC Tray with ESD Protection for Semiconductor IC Packaging
180°C High Temp JEDEC Tray with ESD Protection for Semiconductor IC Packaging
180°C High Temp JEDEC Tray with ESD Protection for Semiconductor IC Packaging
180°C High Temp JEDEC Tray with ESD Protection for Semiconductor IC Packaging

Shenzhen Hiner Technology Co., Ltd.

Verified Supplier
6 Years
guangdong, shenzhen
Since 2013
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Seller, Other
Total Annual :
5,000,000.00-10,000,000.00
Employee Number :
80~100
Certification Level :
Verified Supplier
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