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Cavity Size of 6.71*3.90*0.66 Black Bare Die Tray for Performance
Cavity Size of 6.71*3.90*0.66 Black Bare Die Tray for Performance
Cavity Size of 6.71*3.90*0.66 Black Bare Die Tray for Performance
Cavity Size of 6.71*3.90*0.66 Black Bare Die Tray for Performance
Cavity Size of 6.71*3.90*0.66 Black Bare Die Tray for Performance
Cavity Size of 6.71*3.90*0.66 Black Bare Die Tray for Performance
Cavity Size of 6.71*3.90*0.66 Black Bare Die Tray for Performance
Cavity Size of 6.71*3.90*0.66 Black Bare Die Tray for Performance
Specifications
Brand Name :
Hiner-pack
Model Number :
HN24045
Place Of Origin :
Shenzhen, China
Certification :
ROHS
MOQ :
1000 Pcs
Price :
$0.35~$0.85(Prices Are Determined According To Different Incoterms And Quantities）
Packaging Details :
It Depends On The QTY Of Order And Size Of Product
Delivery Time :
5~8 Working Days
Payment Terms :
T/T
Supply Ability :
4000PCS~5000PCS/per Day
Place of Origin :
Shenzhen,China
Anti-Static :
Yes
Use :
Transport, Storage, Packing
Flatness :
<0.3mm
Size :
Customized
Injection Mold :
Lead Time 20~25 Days
Color :
Black
Shape :
Rectangular
Heat Resistant :
Yes
Description

Product Description:

Our Bare Die Trays can provide a secure and organized way to handle delicate bare die components during production, assembly, testing, and shipping.They are designed in a rectangular shape to efficiently accommodate multiple bare die chips. Their customized size ensures a perfect fit for various die sizes, offering flexibility and versatility in handling different types of components. These trays come in a sleek black color, giving them a professional and modern look suitable for industrial environments.


Technical Parameters:

Durability Sturdy And Impact-Resistant
Color Black
Injection Mold Lead Time 20~25 Days
Capacity Holds Multiple Bare Die Chips
Customizable Logo Yes
Flatness <0.3mm
Shape Rectangular
Size Customized
Anti-Static Yes
Surface Resistance 1.0x10E4~1.0x10E11Ω

Applications:

I.Chip On Board (COB) Assembly

Bare Die Trays provide secure positioning and electrostatic discharge (ESD) protection for singulated semiconductor dice during manual or automated COB assembly processes.

II.Flip Chip and 3D Packaging

The trays' precision-engineered pockets accommodate backside-exposed dice required for flip chip bonding, enabling accurate alignment during flux application and reflow processes.

Support and Services:

♠Customized Packaging Solutions: We offer tailored Bare Die Trays designed to meet the specific requirements of your die sizes and configurations, ensuring optimal protection and handling during transportation and storage.


♠On-site Technical Support: Our team of experts provides on-site assistance for the installation, integration, and troubleshooting of Bare Die Trays, ensuring seamless operations and minimizing downtime.

FAQ:

Q:How long can the production be put into production after the order is placed?

A:Generally, it takes one or two working days.

Q: What is the minimum order quantity for the Bare Die Trays?
A: The minimum order quantity for the Bare Die Trays is 1000 pieces.

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Cavity Size of 6.71*3.90*0.66 Black Bare Die Tray for Performance

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Product Detail
Brand Name :
Hiner-pack
Model Number :
HN24045
Place Of Origin :
Shenzhen, China
Certification :
ROHS
MOQ :
1000 Pcs
Price :
$0.35~$0.85(Prices Are Determined According To Different Incoterms And Quantities）
Contact Supplier
Cavity Size of 6.71*3.90*0.66 Black Bare Die Tray for Performance
Cavity Size of 6.71*3.90*0.66 Black Bare Die Tray for Performance
Cavity Size of 6.71*3.90*0.66 Black Bare Die Tray for Performance
Cavity Size of 6.71*3.90*0.66 Black Bare Die Tray for Performance

Shenzhen Hiner Technology Co., Ltd.

Verified Supplier
5 Years
guangdong, shenzhen
Since 2013
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Seller, Other
Main Products :
JEDEC IC Trays, JEDEC Matrix Trays, IC Chip Tray
Total Annual :
5,000,000.00-10,000,000.00
Employee Number :
80~100
Certification Level :
Verified Supplier
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