MachineU > China Products > Packaging & Printing > Logistics Packaging > Pallets
Durable High-Temp ESD Waffle Pack Tray with Precision Grid Design for IC Chips
Durable High-Temp ESD Waffle Pack Tray with Precision Grid Design for IC Chips
Durable High-Temp ESD Waffle Pack Tray with Precision Grid Design for IC Chips
Durable High-Temp ESD Waffle Pack Tray with Precision Grid Design for IC Chips
Durable High-Temp ESD Waffle Pack Tray with Precision Grid Design for IC Chips
Durable High-Temp ESD Waffle Pack Tray with Precision Grid Design for IC Chips
Durable High-Temp ESD Waffle Pack Tray with Precision Grid Design for IC Chips
Durable High-Temp ESD Waffle Pack Tray with Precision Grid Design for IC Chips
Durable High-Temp ESD Waffle Pack Tray with Precision Grid Design for IC Chips
Durable High-Temp ESD Waffle Pack Tray with Precision Grid Design for IC Chips
Specifications
Cavity Size :
1.68x1.55x0.67 mm
Mold Type :
Injection
Model Number :
HN24177
Price :
$1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities）
Color :
Black
Packaging Details :
CARTON, PALLET
Clean Class :
General And Ultrasonic Cleaning
Packing Level :
Transport package
Outline Line Size :
50.7×50.7×7.4 mm
Certification :
ROHS, ISO
Warpage :
Warpage MAX 0.21mm
Place of Origin :
China
Supply Ability :
2000PCS/Day
Tray Weight :
Varies, Typically Up To 500 Grams Per Cavity
Reusable :
Yes
Ic Type :
BGA,QFP,QFN,LGA,PGA
Tray Shape :
Rectangular
Delivery Time :
10 workdays
Payment Terms :
T/T
Incoterms :
EXW, FOB, CIF, DDU, DDP
Brand Name :
Hiner-pack
MOQ :
500 pcs
Capacity :
16x17=272 PCS
Quality Assurance :
Delivery Guarantee, Reliable Quality
Description
Durable High-Temp ESD Waffle Trays for IC Chips

Deliver precise grid structure to hold delicate IC components firmly, preventing shifting and damage during handling. Built with durable material for consistent performance in industrial environments. Offer reliable compatibility with semiconductor production workflows. Seeking high-density trays for secure component storage?


Integrate seamlessly with automated packaging lines and cleanroom workflows. Perform steadily in component loading, transfer, and inventory management procedures. Adapt smoothly to diverse semiconductor manufacturing scenarios.


Support fully customized grid spacing and cavity dimensions to match specific component sizes. Prioritize clean production compatibility. Deliver tailored solutions that optimize packaging efficiency and protect ICs throughout transit.

Key Features/ Benefits
  • Durable construction
  • Precision grid design
  • Suitable for Delicate Fine Pitch ICs
  • Protects delicate fine pitch IC components efficiently
  • Support fully customized cavity sizes and layout designs
  • The factory has ISO certification, and the products comply with the RoHS standard.
Specifications
Brand Hiner-pack
Model HN24177
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 50.7×50.7×7.4 mm
Cavity Size 1.68x1.55x0.67 mm
Matrix QTY 16x17=272 PCS
Warpage MAX 0.21mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
Serve semiconductor IC packaging, cleanroom assembly, component sorting, and high-density storage operations. Compatible with automated handling systems, Class 100/1000 cleanrooms, and high-precision manufacturing lines.


Also utilized in inter-factory component transfer, overseas logistics shipping, and finished component warehousing. Cater to IC manufacturers, packaging houses, and electronic component logistics providers.

Customized Services
Provide fully customized solutions for grid IC waffle trays. Adjust grid spacing, cavity size, and layout to fit diverse component dimensions.

Leverage durable material for enhanced stability. Offer prototype testing and personalized design support to meet unique production and packaging needs.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / Waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers
Send your message to this supplier
Send Now

Durable High-Temp ESD Waffle Pack Tray with Precision Grid Design for IC Chips

Ask Latest Price
Product Detail
Cavity Size :
1.68x1.55x0.67 mm
Mold Type :
Injection
Model Number :
HN24177
Price :
$1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities）
Color :
Black
Packaging Details :
CARTON, PALLET
Contact Supplier
Durable High-Temp ESD Waffle Pack Tray with Precision Grid Design for IC Chips
Durable High-Temp ESD Waffle Pack Tray with Precision Grid Design for IC Chips
Durable High-Temp ESD Waffle Pack Tray with Precision Grid Design for IC Chips
Durable High-Temp ESD Waffle Pack Tray with Precision Grid Design for IC Chips
Durable High-Temp ESD Waffle Pack Tray with Precision Grid Design for IC Chips

Shenzhen Hiner Technology Co., Ltd.

Verified Supplier
6 Years
guangdong, shenzhen
Since 2013
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Seller, Other
Main Products :
JEDEC IC Trays, JEDEC Matrix Trays, IC Chip Tray
Total Annual :
5,000,000.00-10,000,000.00
Employee Number :
80~100
Certification Level :
Verified Supplier
Discover similar products
View More

Find Similar Products By Category:

Supplier Homepage Products IC Chip Tray
MachineU China Products Packaging & Printing Logistics Packaging Pallets
Contact Supplier
Submit Requirement