• ROHS Customized high temperature tray for LGA chip placement function

In the microelectronics industry, there are standards for handling, loading, transporting and storing integrated circuit IC, modules and other electronic components. This is usually referred to as Jedec standard matrix trays. The Jedec Standard Tray is made from molded plastic particles. The Jedec standard Tray is very strong with minimal warpage control to achieve maximum protection of these components.

All Jedc matrix trays are 12.7*5.35inch(322.6*135.9mm) and are suitable for a variety of chip packages, including BGA.CSP.QFP.QFN... And so on.

Many Jedec tray slots are designed in the middle of the tray to allow automatic equipment to pick up the loaded product.

45-degree chamfer is also easier for equipment to identify and locate, thereby reducing labor costs.

Poduct Application

Package IC PCBA module component

Electronic component packaging Optical device packaging

Packaging Details:Packing according to customer's specified size

Reference to temperature resistance of different materials

FAQ

1. How can I get a quotation?
Reply:Please provide the details of your requirements as clear as possible. So we can send you the offer at the first time.
For purchasing or further discussion, it is better to contact us with Skype / Email / Phone / Whatsapp, in case of any delays.

2. How long will it take to get a response?
Reply:We will reply to you within 24 hours of working day.

3. What kind of service we provide?
Reply:We can design IC Tray drawings in advance based on your clear description of the IC or component.Provide one-stop service from design to packaging and shipping.
4. What is your terms of delivery?
Reply:We accept EXW,FOB,CIF,DDU,DDP etc. You can choose the one which is the most convenient or cost effective for you.

5. How to guarantee quality?
Reply:Our samples through strict testing, the finished products comply with the international JEDEC standards, to ensure 100% qualified rate.