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VD55H1CCA0/RW Sensor IC 3D iToF Sensor Die with 0.54 Mpixel Resolution Low-Noise and 80 mW Power Consumption
VD55H1CCA0/RW Sensor IC 3D iToF Sensor Die with 0.54 Mpixel Resolution Low-Noise and 80 mW Power Consumption
Specifications
Delivery Time :
5-8 work days
Model Number :
VD55H1CCA0/RW
Pixel :
0.54 Mpixel
MOQ :
10
Packaging Details :
SMD
Laser driver interface :
LVDS and 3-wire SPI
Payment Terms :
T/T,L/C,Western Union
Price :
Contact for Sample
Type :
Ultra-compact 0.54 Mpix iToF sensor die
Certification :
Lead free / RoHS Compliant
Power Consumption :
Down to 80 mW
Brand Name :
Original Factory
Part Number :
VD55H1CCA0/RW
Place of Origin :
CN
Sensor raw output :
Up to 120 fps (depth-level frame rate)
Description
VD55H1 Sensor IC 3D iToF Sensor Die 0.54Mpix Low-Noise Indirect Time-Of-Flight Sensor Die
Product Overview

VD55H1 is a low-noise, low-power, 672 x 804 pixel (0.54 Mpix), indirect Time-of-Flight (iToF) sensor die manufactured on advanced backside-illuminated, stacked wafer technology. Combined with a 940 nm illumination system, this sensor enables building a small form-factor 3D camera producing a high-definition depth map with typical ranging distance up to 5 meters in full resolution, and beyond 5 meters with patterned illumination.

With a unique ability to operate at 200 MHz modulation frequency and more than 85% demodulation contrast, the VD55H1 can produce depth precision twice as good as typical 100 MHz modulated sensors, while multifrequency operation provides long distance ranging. The low-power 4.6 µm pixel enables state-of-the-art power consumption, with average sensor power down to 80 mW in some modes.

Specifications Of VD55H1
Product Category Distance Sensor ICs & Embedded Modules
Type Time of Flight
Interface Type I2C, SPI
Minimum Operating Temperature -30℃
Maximum Operating Temperature +85℃
Key Features Of VD55H1
  • Ultra-compact 0.54 Mpix iToF sensor die
  • 672 x 804 indirect Time-of-Flight (iToF) sensor die (0.54 Mpixel)
  • 4.6 μm backside illuminated fast photodiode pixel, 1/4'' optical format
  • 4.5 mm x 4.9 mm die manufactured on advanced 40 nm stacked wafer technology
  • Enabling low-power, high precision depth map
  • Pixel with >85% demodulation contrast at 200 MHz modulation frequency
  • Low noise charge domain pixel (kTC free) < 5e-
  • Multifrequency supported (up to three frequencies)
  • Average sensor power consumption down to 80 mW
  • Smart iToF modulation, no need for wiggling error calibration
  • Multi-user interferences reduction
  • Optimized for low EMI/EMC
  • Easy integration for 3D camera
  • Raw data output on MIPI CSI2 interface at 1.5 GHz (quad or dual lane)
  • 10/12-bit configurable ADC resolution
  • Sensor raw output up to 120 fps (depth-level frame rate)
  • Sensor control: Fast mode+ I2C slave interface (up to 1 MHz)
  • Laser driver interface: LVDS and 3-wire SPI
  • Software ISP for depth reconstruction available
Applications Of VD55H1
  • Room mapping and object scanning for enhanced augmented reality user experience
  • Precise depth segmentation for professional bokeh camera effects
  • Secure face authentication for payment and phone unlocking
  • Gesture recognition
  • Mobile devices
  • AR/VR headsets
  • Consumer robots
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Tag: VD55H1CCA0/RW, VD55H1CCA0/R, VD55H1CCA0, VD55H1CCA, VD55H1CC, VD55H1C, VD55H1.
Frequently Asked Questions
Q. Are your products original?
A: Yes, all products are original, new original import is our purpose.
Q: Which Certificates do you have?
A: We are ISO 9001:2015 Certified Company and member of ERAI.
Q: Can you support small quantity order or sample? Is the sample free?
A: Yes, we support sample order and small order. Sample cost is different according to your order or project.
Q: How to ship my order? Is it safe?
A: We use express to ship, such as DHL, Fedex, UPS, TNT, EMS. We can also use your suggested forwarder. Products will be in good packing and ensure the safety and we are responsible to product damage to your order.
Q: What about the lead time?
A: We can ship stock parts within 5 working days. If without stock, we will confirm lead time for you based on your order quantity.
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VD55H1CCA0/RW Sensor IC 3D iToF Sensor Die with 0.54 Mpixel Resolution Low-Noise and 80 mW Power Consumption

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Product Detail
Delivery Time :
5-8 work days
Model Number :
VD55H1CCA0/RW
Pixel :
0.54 Mpixel
MOQ :
10
Packaging Details :
SMD
Laser driver interface :
LVDS and 3-wire SPI
Contact Supplier
VD55H1CCA0/RW Sensor IC 3D iToF Sensor Die with 0.54 Mpixel Resolution Low-Noise and 80 mW Power Consumption

ShenZhen Mingjiada Electronics Co.,Ltd.

Verified Supplier
5 Years
shenzhen
Business Type :
Distributor/Wholesaler
Main Products :
Integrated Circuit Chip, BT IC, Automotive IGBT Modules
Total Annual :
1000000-2000000
Employee Number :
20~50
Certification Level :
Verified Supplier
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