Direct Bonded Copper Ceramic Substrate
DBC ceramic substrate, short for "direct bonded copper ceramic substrate," is an advanced material consisting of a ceramic substrate (usually Al2O3 or AlN) and copper tightly bonded together through a hypoeutectic process. This unique combination of materials produces a substrate with exceptional thermal conductivity, low thermal expansion, high strength, and excellent wettability for soldering.
Material properties of direct bonded copper-ceramic substrates
Applications of direct bonded copper-ceramic substrates
- Power electronics: IGBT, MOSFET, thyristor module, solid-state relay, diode, power transistors
- Automotive: ABS, power steering, DC/DC converter, LED lighting, ignition control system
- Household appliances: air conditioner, Peltier cooler
- Environmental technologies: Local power generation, electric vehicles, traction control systems, photovoltaic units, wind energy
- Industry: LED displays, welding machines
- Aerospace: laser, power source for satellites and aircraft
- PC/IT: power supply, UPS system