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50-01-1121-0000
50-01-1121-0000
Specifications
Category :
RF and Wireless RFI and EMI - Shielding and Absorbing Materials
Adhesive :
-
Product Status :
Active
Thickness - Overall :
-
Package :
Bulk
Series :
CHO-BOND® 1121
Material :
Silicone
Mfr :
Parker Chomerics
Shelf Life Start :
Date of Manufacture
Width :
-
Shape :
-
Length :
-
Shelf Life :
12 Months
Storage/Refrigeration Temperature :
77°F (25°C)
Operating Temperature :
-
Type :
EMI Conductive Sealant
Base Product Number :
50-01
Description :
SILVER COPPER EMI SEALANT 454G
Stock :
In Stock
Shipping Method :
LCL, AIR, FCL, Express
Payment Terms :
L/C, D/A, D/P, T/T, Western Union, MoneyGram
Description
RF EMI EMI Conductive Sealant CHO-BOND® 1121 Silicone X X
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50-01-1121-0000

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Product Detail
Category :
RF and Wireless RFI and EMI - Shielding and Absorbing Materials
Adhesive :
-
Product Status :
Active
Thickness - Overall :
-
Package :
Bulk
Series :
CHO-BOND® 1121
Contact Supplier
50-01-1121-0000

Shenzhen Tengshengda ELECTRIC CO., LTD.

Active Member
3 Years
guangdong, shenzhen
Since 2005
Business Type :
Trading Company
Main Products :
Integrated Circuit Chips, Flash Memory IC Chip, TI Integrated Circuit
Total Annual :
4000000-6000000
Employee Number :
250~350
Certification Level :
Active Member
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