Specifications
Package / Case : :
1760-BBGA, FCBGA
Product Category : :
Systems on a Chip - SoC
Primary Attributes : :
Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Speed : :
533MHz, 600MHz, 1.3GHz
Supplier Device Package : :
1760-FCBGA (42.5x42.5)
Flash Size : :
-
RAM Size : :
256kB
Connectivity : :
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature : :
-40°C ~ 100°C (TJ)
Package : :
Tray
Architecture : :
MCU, FPGA
Core Processor : :
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Product status : :
Active
Peripherals : :
DMA, WDT
Series : :
Zynq® UltraScale+™ MPSoC EG
Manufacturer : :
Xilinx Inc
Description :
IC SOC CORTEX-A53 1760FCBGA
Stock :
In Stock
Shipping Method :
LCL, AIR, FCL, Express
Payment Terms :
L/C, D/A, D/P, T/T, Western Union, MoneyGram
Description
The XCZU19EG-2FFVD1760I,from Xilinx Inc,is Systems on a Chip - SoC.what we offer have competitive price in the global market,which are in original and new parts.If you would like to know more about the products or apply a lower price, please contact us through the “online chat” or send a quote to us!
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XCZU19EG-2FFVD1760I

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Package / Case : :
1760-BBGA, FCBGA
Product Category : :
Systems on a Chip - SoC
Primary Attributes : :
Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Speed : :
533MHz, 600MHz, 1.3GHz
Supplier Device Package : :
1760-FCBGA (42.5x42.5)
Flash Size : :
-
Contact Supplier
XCZU19EG-2FFVD1760I
XCZU19EG-2FFVD1760I
XCZU19EG-2FFVD1760I

Shenzhen Tengshengda ELECTRIC CO., LTD.

Active Member
3 Years
guangdong, shenzhen
Since 2005
Business Type :
Trading Company
Total Annual :
4000000-6000000
Employee Number :
250~350
Certification Level :
Active Member
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