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BWS3BTCDC-60G BWS3BTCDC-120G BGA SSD Flash IC For In-vehicle / Notebook
BWS3BTCDC-60G BWS3BTCDC-120G BGA SSD Flash IC For In-vehicle / Notebook
Specifications
Description :
eSSD is an embedded solid state driver solution designed in the form of TFBGA packaging
Stock :
In Stock
MOQ :
100pieces
Price :
Negotiated
Payment Terms :
T/T, Western Union
Shipping Method :
Express
Category :
Electronic components-Memory
Family :
BIWIN eSSD BGA IC Chip
Application :
In-vehicle/ Notebook
Operating Temperature :
Consumer Grade: 0℃ - 70℃ Industrial Grade: -25℃ - 85℃
Selection Part numbers :
BWS3BTCDC-60G BWS3BTCDC-120G
Product specifications Interface :
eSSD is characterized by its low power consumption and since it's a non-volatile memory device
Dimensions :
PCIe 4.0 x 2: 11.50 × 13.00 mm PCIe 3.0 x 2: 11.50 × 13.00 mm / 12.00 × 16.00 mm SATA III: 16.00 × 20.00 mm
Working Voltage :
PCIe 4.0 x 2: VCC=2.5 V, VCCQ =1.2 V, VCCK=0.8 V PCIe 3.0 x 2: VCC=3.3 V, VCCQ =1.2 V, VCCK=0.9 V SATA III: VCC=3.3 V, VCCQ =1.8 V, VCCK=1.1 V
Capacity :
PCIe 4.0 x 2: 256 GB - 1 TB PCIe 3.0 x 2: 128 GB - 256 GB SATA III: 32GB - 256 GB
Description

BWS3BTCDC-60G BWS3BTCDC-120G BGA SSD Flash IC For In-vehicle / Notebook​

Application:

In-vehicle / Notebook

BWS3BTCDC-60G BWS3BTCDC-120G BGA SSD Flash IC For In-vehicle / Notebook

eSSD is characterized by its low power consumption and since it's a non-volatile memory device, it can maintain stored data without power supply. It also has a wide range of operating temperature, high shock and vibration tolerance.

Specification:

Interface PCIe 4.0 x 2
PCIe 3.0 x 2
SATA III
Dimensions PCIe 4.0 x 2: 11.50 × 13.00 mm
PCIe 3.0 x 2: 11.50 × 13.00 mm / 12.00 × 16.00 mm
SATA III: 16.00 × 20.00 mm
Max. Sequential Read PCIe 4.0 x 2: 3500 MB/s
PCIe 3.0 x 2: 1900 MB/s
SATA III: 470 MB/s
Max. Sequential Write PCIe 4.0 x 2: 3200 MB/s
PCIe 3.0 x 2: 650 MB/s
SATA III: 350 MB/s
Frequency /
Capacity PCIe 4.0 x 2: 256 GB - 1 TB
PCIe 3.0 x 2: 128 GB - 256 GB
SATA III: 32GB - 256 GB
Working Voltage PCIe 4.0 x 2: VCC=2.5 V, VCCQ =1.2 V, VCCK=0.8 V
PCIe 3.0 x 2: VCC=3.3 V, VCCQ =1.2 V, VCCK=0.9 V
SATA III: VCC=3.3 V, VCCQ =1.8 V, VCCK=1.1 V
Working Temperature Consumer Grade: 0℃ - 70℃
Industrial Grade: -25℃ - 85℃
Approved Verification Platforms /
Packaging PCIe 4.0 x 2: FBGA345
PCIe 3.0 x 2: FBGA291 / FBGA345
SATA III: FBGA157
Application In-vehicle / Notebook

BWS3BTCDC-60G BWS3BTCDC-120G BGA SSD Flash IC For In-vehicle / Notebook

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BWS3BTCDC-60G BWS3BTCDC-120G BGA SSD Flash IC For In-vehicle / Notebook

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Product Detail
Description :
eSSD is an embedded solid state driver solution designed in the form of TFBGA packaging
Stock :
In Stock
MOQ :
100pieces
Price :
Negotiated
Payment Terms :
T/T, Western Union
Shipping Method :
Express
Contact Supplier
BWS3BTCDC-60G BWS3BTCDC-120G BGA SSD Flash IC For In-vehicle / Notebook

Angel Technology Electronics Co

Verified Supplier
5 Years
hongkong, shenzhen
Since 2006
Business Type :
Manufacturer, Distributor/Wholesaler, Agent
Main Products :
PMIC Chip, Integrated Circuits IC, Electronics Components
Total Annual :
80 millions-500 millions
Employee Number :
20~200
Certification Level :
Verified Supplier
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