The OMA-SMD7050 is a miniature AT-cut strip oscillator unit with an SMD7050 miniature base. It is designed for applications requiring precise frequency control, including WLAN/WiMAX, mobile phones, DSC, Set-Top Boxes, and HDTV.
| Item | Symbol | Min. | Type | Max. | Unit | Remark |
| Nominal Frequency | F0 | - | 54.000000 | - | MHz | - |
| Supply Voltage | Vdd | 2.97 | 3.3 | 3.63 | V | - |
| Operating Temperature | TOPR | -20 | - | 70 | - | |
| Frequency Stability | Fr | -50 | - | 50 | ppm | Overall |
| Current Consumption | Icc | - | - | 30 | mA | at 253 |
| Output Load Capacitance | CL | - | 15 | - | pF | - |
| Output High Voltage | VOH | 90%Vdd | - | - | V | at 253 |
| Output Low Voltage | VOL | - | - | 10%Vdd | V | at 253 |
| Rise Time | Tr | - | - | 5 | nSec | at 10% to 90% Vdd |
| Fall Time | Tf | - | - | 5 | nSec | at 10% to 90% Vdd |
| Duty Cycle | - | 45 | 50 | 55 | % | at 253 |
| Start Time | - | - | - | 5 | mSec | - |
| Aging (First Year) | - | - | 3 | - | ppm | - |
| Storage Temperature | TSTG | -55 | - | 125 | (Humidity: 40%~60%) |
Refer to Figure 6.1 for detailed product dimensions and solder pad layout.
Refer to Figure 6.2 for marking details.
Refer to Figure 6.3 for the measurement circuit.
Refer to Figure 6.4 for the output waveform.
Refer to Section 7 for the IR reflow profile specifications, based on JEDEC J-STD-020C.
Refer to Section 8 for detailed packing specifications, including tape dimensions, reel and inner box dimensions, and carton dimensions.
Refer to Section 9 for a comprehensive list of reliability tests performed on the OMA-SMD7050, including High Temperature Storage, Vibration, Fine Leak, Drop Test, Solderability, Aging, Salt Spray, Humidity, Temperature Cycle, Thermal Shock, and IR Reflow.
Refer to Section 10 for important handling and control procedures, including precautions for storage, mounting of SMD type products, ultrasonic cleaning, and ultrasonic welding.