| 1 | Capacitance Deviation | Frequency: 1KHz 0.1KHz, Measurement Voltage: 1Vrms | 5% (J), 10% (K) |
| 2 | Dissipation Factor | Frequency: 1KHz 0.1KHz, Measurement Voltage: 1Vrms | 0.8% |
| 3 | Insulation Resistance | Test Voltage: UR>100VDC at 100VDC, UR100VDC at 10VDC. Temp: 2015. Duration: 605sec. | U>100V: C0.33uF 15000M; C>0.33uF 7500S. U100V: C0.33uF 3000M; C>0.33uF 1000S. (All measured at 20, 100V/10V, 1min) |
| 4 | Withstand Voltage | Between leads: 1.6UR for 5s. Lead to case: 2UR for 5s. | No breakdown or flashover. |
| 5 | Rapid Change of Temperature | Temp: A=-55, B=+110. Exposure at high/low temp: 30min. Transition time: 23min. Cycles: 5. | No visible damage to appearance. c/c5%, tg0.8%. |
| 6 | Lead Tensile Strength | (See table) | No mechanical damage. |
| 7 | Lead Bending Strength | (See table) | No mechanical damage. |
| 8 | Solderability | Temp: 2605. Time: 2.00.5sec. Solder: Lead-free. | Over 95% area tinned. |
| 9.1 | Temperature Cycling | 5 cycles: +20 (3min), -55 (30min), +20 (3min), +110 (30min), +20 (3min). | No significant change in appearance. Withstand Voltage: Meets No. 4. C/C 5%. DF < 0.20% (1KHz). |
| 9.2 | High Temperature Load | Temp: +1102. Voltage: 110%UR for 1000+24/-0 hours. | No significant change in appearance. Withstand Voltage: Meets No. 4. C/C 8%. DF < 0.20% (1KHz). I.R. 50% of initial. |
| 9.3 | Humid Heat Load | Temp: +402. Humidity: 90% to 95% R.H. Voltage: Rated voltage. Duration: 500+24/-0 hours. | No significant change in appearance. Withstand Voltage: Meets No. 4. C/C 10%. DF < 0.20% (1KHz). I.R. 50% of initial. |
| 9.4 | Soldering Heat Withstand Capability | Soldering Temp: 2605. Immersion Time: 50.5 sec (P=5mm), 100.5 sec (P=7.5mm). Immersion Depth: 40.8 mm from the root. | Withstand Voltage: Meets No. 4. C/C 3%. Connection should be stable. |
| 9.5 | Dry Heat Resistance | Temp: +1102. Duration: 16+1/-0 hours. | Withstand Voltage: Meets No. 4. C/C 5%. |
| 9.6 | Cold Resistance | Temp: -552. Duration: 21 hours. | Withstand Voltage: Meets No. 4. C/C 5%. |
| 9.7 | Anti-vibration | Frequency: 10-500 Hz. Amplitude: 0.75 mm. Duration: 2 hours per direction (X, Y, Z). | Connection strength: No open or short circuit. Connection should be stable. No mechanical damage. |
| 9.8 | Severe Temperature Change | High Temp: +1105. Low Temp: -555. Each temp: 30 min 10%. | Withstand Voltage: Meets No.4. No mechanical damage. |
| 9.9 | Short Circuit Charge/Discharge | Voltage: UR. Number of cycles: 3. Sample: 10 pcs/batch. | C/C 3% (1KHz). DF < 3% (10KHz). I.R.: Meets No. 3. |
| 9.10 | Normal Temperature Storage | Temp: 35. Humidity: 80%. Duration: 30-35 days. | C/C 2% (1KHz). DF: Meets No. 2. I.R.: Meets No. 3. |