Specifications
Brand Name :
Sireda
Model Number :
Flip-top Test Socket
Certification :
ISO9001
Place of Origin :
China
MOQ :
1
Price :
Get Quote
Pitch :
≥0.3mm
Pin Count :
2-2000+
Compatible Packages: :
BGA, QFN, LGA, SOP, WLCSP
Thermal Solution :
Heat Sink, Air Fan, liquid cooling
Socket Type :
Flip-Top, Open Top, ATE-Compatible
Conductor Type :
Probe Pins, Pogo Pin, PCR
Operating Temp. :
-55°C to +150°C
Features :
Highly customizable
Description

IC Test Socket - Multiple Styles Available (Clame Shell Lid Focus)

Need the right IC test socket for your chip? Provide your drawings and describe your use case—our experts will recommend the best fit! Whether you prioritize quick flip-top access, precise adjustment, or advanced thermal management, we have optimized solutions for fast and reliable testing. Get a custom-matched socket for seamless inspection and validation.

Customizable Multiple Styles IC Test Socket For BGA/QFN/SOP Packages

Flip-top Socket

Suitable for quick chip replacement with under 200 balls to enhance efficiency.

Rotating knob top

Ideal for chips with over 200 balls to prevent ball damage during handling.

Cover with thickness adjustment dial

Allows rapid adaptation for chips of varying thicknesses.

Pressure block with heat sink

Incorporates cooling features to manage heat during operations.

Top-mounted cooling fan

Ensures active thermal regulation for prolonged usage stability.

Below are the essential specifications engineers evaluate when selecting test sockets for maximum reliability and throughput:

IC Test Socket: Core Specifications

Property

Parameter

Typical Value

Mechanical

Insertion Cycles

≥30K–50K cycles

Contact Force

20–30g/pin

Operating Temperature

Commercial -40 ~ +125
Military -55 ~ +130

Tolerance

±0.01mm

Electrical

Contact Resistance

<50mΩ

Impedance

50Ω (±5%)

Current

1.5A~3A

We provide a complete range of IC test socket solutions, from industry-standard designs to fully customized configurations.

Our standard offerings include:

  • BGA Test Sockets (pitch 0.3mm to 1.27mm)
  • QFN/LGA Sockets (low insertion force designs)
  • High Frequency Sockets (up to 67GHz performance)
  • Burn-in and Automotive Sockets (extended durability versions)

Need something different? We specialize in custom socket designs for:

  • Non-standard IC packages
  • Extreme environment testing (high temp/vibration)
  • High current applications
  • Special signal integrity requirements

Get exactly what you need:

  • Free design consultation
  • Fast prototyping (samples in 14 days)
  • Custom testing validation

[Contact our engineering team] today to discuss your specific test socket requirements.

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Customizable Multiple Styles IC Test Socket For BGA/QFN/SOP Packages

Ask Latest Price
Brand Name :
Sireda
Model Number :
Flip-top Test Socket
Certification :
ISO9001
Place of Origin :
China
MOQ :
1
Price :
Get Quote
Contact Supplier
Customizable Multiple Styles IC Test Socket For BGA/QFN/SOP Packages
Customizable Multiple Styles IC Test Socket For BGA/QFN/SOP Packages
Customizable Multiple Styles IC Test Socket For BGA/QFN/SOP Packages
Customizable Multiple Styles IC Test Socket For BGA/QFN/SOP Packages

Sireda Technology Co., Ltd.

Verified Supplier
1 Years
shenzhen
Since 2010
Business Type :
Manufacturer
Total Annual :
10000000-50000000
Employee Number :
101~120
Certification Level :
Verified Supplier
Contact Supplier
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