Photo Chemical Etching Micro Etched Lead Frames with Customized Materials
Lead Frames Overview
Xinhaisen Technology specializes in manufacturing precision-etched lead frames for semiconductor and microelectronics packaging. Our lead frames serve as the critical interconnection platform for IC chips, providing superior electrical conductivity, heat dissipation, and mechanical stability. Utilizing advanced chemical etching technology, we deliver products with unmatched dimensional accuracy for applications in QFN, DFN, SOP, SSOP and other advanced packaging formats.
Lead Frames Features
·Ultra-Precise Etching Technology
·Achieves fine pitch down to 0.05mm with tight tolerance of ±0.01mm
·Produces smooth burr-free edges for perfect die attachment
Lead Frames Specification
Parameter | Specification |
Materials | Stainless Steel,Copper,alloys |
Tolerance | ±0.01mm |
Surface Roughness | Ra ≤ 0.8μm |
Minimum Pitch | 0.05mm(customized) |
Competitive Advantages
·Precision Beyond Stamping
·Achieves finer features and tighter tolerances than conventional stamping
·No mechanical stress or deformation
FAQ
1.Why Choose Xinhaisen?
·13+ years of specialized etching experience
·Engineering support from design to final product
·Strict confidentiality protection for all customer designs
2.How long does production and shipping take?
A: Sample orders can be shipped in 3-5 days. Mass production lead time depends on quantity, typically 1-2 weeks. Express shipping is available.
3. What services can we provide?
·Accepted Delivery Terms: FOB,CFR,CIF,EXW;
·Accepted Payment Currency:USD,EUR,JPY,CAD,AUD,HKD,CNY;
·Accepted Payment Type: T/T,Paypal,Western Union,Cash;
·Language Spoken:English,Chinese
Welcome to contact!