Metal Chemical Etching Flow Field Plates for Printed Circuit Heat Exchanger Manufacturing

Xinhaisen utilizes the photochemical etching process to produce flow plates for printed circuit heat exchangers (PCHEs), enabling the creation of precise microchannels and intricate designs.

Description of Flow Field Plates for Printed Circuit Heat Exchangers

What is Printed Circiut Heat Exchangers?

The Printed Circuit Heat Exchanger (PCHE), or Diffusion Bonded Compact Heat Exchanger (DCHE), is an advanced heat exchanger that integrates chemically etched microchannels with diffusion bonding. This solid block design ensures high strength, excellent thermal efficiency, and reliable performance under extreme operating conditions.

Specifications of Flow Field Plates for Printed Circuit Heat Exchangers

Manufacturing of Flow Field Plates for Printed Circuit Heat Exchangers

1.Chemical etching micro channels of compact heat exchanger plates

Chemical etching (also called photo etching or photochemical machining, PCM) is a precise metal machining process that removes selected areas of metal using chemical solutions (etchants).

• Metal Preparation – The metal sheet is cleaned to remove oils, oxides, or contaminants.

• Coating – A light-sensitive coating (photoresist) is applied to the sheet.

• Exposure– The desired design is transferred onto the photoresist using UV light and a photomask. Areas exposed to light harden, while unexposed areas remain soft.

• Developing – The soft photoresist is washed away, exposing bare metal in the areas to be etched.

• Etching – The sheet is placed in an etchant solution (commonly ferric chloride, cupric chloride, or nitric acid, depending on the metal). The chemical dissolves the unprotected areas, creating the desired pattern.

• Stripping & Finishing – The hardened photoresist is removed, leaving behind the precise etched part.

2. Diffusion bonded compact heat exchangers plates

We specialize in delivering end-to-end solutions for printed circuit heat exchangers (PCHEs). By integrating precision chemical etching with advanced diffusion bonding, we ensure that every heat exchanger offers high reliability, outstanding efficiency, and consistent performance to meet demanding application needs.

Packing and Shipping of Flow Field Plates for Printed Circuit Heat Exchangers

Packing Methods:

We offer multiple packaging options to ensure maximum protection, including protective covers, PE bags, and foam inserts. Customized packaging solutions are also available upon request.

Shipment Methods:

By Air/ Sea/ EMS/ DHL/ FedEx/ UPS

How to custom Flow Field Plates for Printed Circuit Heat Exchangers from us?

1. Please send us your design.
We accept the following file formats:DWG, DXF, PDF, STP, Gerber, IGES, CorelDraw and AI.

2. Samples making lead time:3-10days

3. Express:By DHL, FedEx, TNT, around 3-7days.