Product Description: Heat Activation Hot Melt Adhesive Tape for Chip Modules Embedded PC / PVC /ABS Substrate Physical Characteristics: Color transparent Release liner Glassine release paper Density 1.2±0.02g/cm³ ...learn more
Heat Activation Hot Melt Adhesive Tape For Chip Modules Embedded Substrate

Heat Activation Hot Melt Adhesive Tape For Chip Modules Embedded Substrate
40000 Square meters per day
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Shenzhen Tunsing Plastic Products Co., Ltd.

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