MachineU > China Products
Semi-Dicing System Ceramic Plate Cutting Machine
Semi-Dicing System Ceramic Plate Cutting Machine
Specifications
Description
Applications
Automatic dicing system is widely used in semiconductor chip, LED chip and EMC lead frame, PCB, IR filter, sapphire glass and ceramic thin plate’s precision cutting .
Features of products
• Using touching LCD to operate. The interface design is simple and easy. Provide a variety of languages such as Chinese, English, Korean, etc.
• Can meet the high precision cutting maximum diameter of 300 mm materials.
• High rigidity structure design is adopted to ensure high precision and high stability of cutting process.
• CCD automatic positioning and calibration.
• Real-time monitoring of the air pressure, water pressure, current and other values of the system to avoid spindle damage. • Cutting spindle: 2.4 kw × 1set (Max: 60,000 rpm) • Repeat positioning accuracy: 0.001mm
• Cutting speed: 0.05 ~ 400 mm/sec
• Standard collocation blade: 2 Inch (Max: 3 Inch)

Semi-Dicing System Ceramic Plate Cutting Machine

Semi-Dicing System Ceramic Plate Cutting Machine

Semi-Dicing System Ceramic Plate Cutting Machine
Send your message to this supplier
Send Now

Semi-Dicing System Ceramic Plate Cutting Machine

Ask Latest Price
Product Detail
Contact Supplier
Semi-Dicing System Ceramic Plate Cutting Machine

YUSH Electronic Technology Co.,Ltd

Verified Supplier
1 Years
guangdong, dongguan
Since 2024
Business Type :
Manufacturer
Main Products :
Auto Drying Cabinet, Auto Solder Paste Printer, Desktop PCB Router Depaneling Machine
Total Annual :
500000-800000
Employee Number :
50~60
Certification Level :
Verified Supplier
Discover similar products
View More

Find Similar Products By Category:

Supplier Homepage Products PCB/PCBA Cleaning Machine
MachineU China Products
Contact Supplier
Submit Requirement