Product Overview: Boron Nitride Ceramic Solutions

Hexagonal Boron Nitride (HBN) ceramics, known as "white graphite," deliver exceptional performance in high-temperature semiconductor applications. With a graphite-like crystal structure and superior thermal properties, HBN components offer outstanding heat resistance, thermal stability, and electrical insulation—making them ideal for demanding semiconductor manufacturing environments.

Key Features & Technical Advantages

• Excellent Thermal Management: High thermal conductivity ensures efficient heat dissipation in extreme conditions

• Superior Temperature Resistance: Maintains structural integrity and performance at elevated temperatures

• Advanced Manufacturing: Hot pressing technology enables production of large components up to 650mm diameter

• Optimized Material Properties:

  • Very low porosity for enhanced durability

  • Ultra chemical resistance against corrosive environments

  • Direct sintered for net shape manufacturing

  • Mohs hardness 2 allows easy machining into complex geometries

Primary Applications in Semiconductor Equipment

Precision Components:

• Gas distribution plates & spray nozzles

• Top nozzles and baffles

• Pedestal heaters & cover plates

• RF windows & crucibles

• Wafer processing components & rings

• Heat resistant substrates & base materials

Why Choose Our Boron Nitride Ceramics?

Our HBN components are engineered for reliability in the most demanding semiconductor applications. The combination of net shape sintering capability, large diameter manufacturing (up to 650mm), and exceptional thermal properties makes them the optimal choice for:

• High-temperature thermal management

• Corrosive environment applications

• Precision semiconductor manufacturing

• Custom-shaped components requiring minimal post-processing

Materials Properties:

Manufacturing Processes: