Superior Thermal Conductivity for Demanding Electronics

Our D50 Aluminum Oxide Ceramic Powder (Alpha Alumina) is a high-purity, spherical powder engineered for advanced thermal management solutions. With a consistent spherical morphology and tightly controlled particle size distribution, it enables superior filler loading in thermal interface materials (TIMs), resulting in exceptional heat dissipation for modern electronics.

Key Features & Benefits:

• High Purity & Performance: ≥99.5% Al2O3 content ensures excellent electrical insulation and optimal thermal performance.

• Spherical Morphology: Perfectly round particles reduce viscosity, improve flowability, and allow for high packing density in composites.

• Controlled Particle Size (D50): Available in standard D50 sizes from 5μm to 70μm for precise formulation and efficient filling of microscopic gaps.

• Enhanced Thermal Conductivity: High filler loadings directly translate to superior heat conduction in polymers and gels.

• Customizable Grading: Particle size distribution can be adjusted to meet specific application requirements.

Technical Specifications

Primary Applications:

• Thermal Interface Materials (TIMs): High-performance thermal greases, gap fillers, and thermally conductive gels.

• Thermal Conductive Pads & Gaskets: Enhancing heat transfer in power electronics, LEDs, and computing hardware.

• Electronic Packaging: Used as a filler in epoxy molding compounds (EMCs) and underfills for improved thermal management.

• Advanced Composites: Functional filler in plastics, silicones, and ceramics to boost thermal properties.

Why Choose Our Alpha Alumina Powder?

This powder is the ideal choice for formulators seeking to maximize the thermal conductivity of their products without compromising on processability. Its high purity and spherical shape are critical for creating effective and reliable thermal management solutions in next-generation applications.