Hot Sales FPC flexible pcb circuit board manufacturing services factory for electronic parts Service Manufacturers
FPC Production Capability
| Item | Flex PCB |
| Material | PI, PET |
| Layers | 1-12 |
| Base Copper Thickness | 1/4-2OZ |
| Board Thickness(Min.) | Single-sided | 0.05mm |
| Double-sided | 0.10mm |
| Board Dimension(Max.) | 500mm*1000mm |
| | Copper Weight: up to 0.2OZ | 0.04mm |
| Copper Weight: up to 0.5OZ | 0.06mm |
| Copper Weight: 0.5-1OZ | 0.075mm |
| Copper Weight: over 1OZ | 0.10mm |
| Via Type | Through Hole, Blind, Buried |
| Silkscreen Width/Space(Min.) | 0.10mm |
| Solder Mask Bridge(Min.) | 0.2mm for coverlay, 0.12mm for LPI |
| Hole(Min.) | Drill | 0.15mm |
| | Punching | 0.5mm |
| Slot(Min.) | 0.5mm(Punching), 0.8mm(Routing) |
| Dimension Tolerance | Line Width | ±0.03mm(W≤0.3mm), ±10%(W>0.3mm) |
| Hole | ±0.05mm(NPTH) |
| ±0.075mm(PTH) |
| Outline | ±0.10mm, Special±0.05mm with high-precise hard tool |
| Conductor to Outline | ±0.10mm, Special±0.05mm with high-precise hard tool |
| Surface Treatment | Ni/Au Plating | Ni: 2-8um(80-320u") Au: 0.05-2um(2-80u") |
| ENIG | Ni: 2-6um(80-240u") Au: 0.05-0.10um(2-4u") |
| Tin Plating | 5-20um |
| Immersion Silver | 0.2-0.4um |
| Immersion Tin | 1um(Min.) |
| OSP | 0.2um(Min.) |
| Hard Gold | Hardness over 150HV |
| Others | Gold Plating+ENIG; ENIG+OSP; ENPIG |
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