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| | ----Professional Surface-mounting and Through-hole soldering technology |
| ----Various sizes like 1206,0805,0603 components SMT technology |
| ----ICT(In Circuit Test),FCT(Functional Circuit Test) |
| ----PCB Assembly With UL,CE,FCC,Rohs Approval |
| ----Nitrogen gas reflow soldering technology for SMT. |
| ----High Standard SMT&Solder Assembly Line |
| ----High density interconnected board placement technology capacity. |
| | Passive Down to 0201 size |
| BGA and VFBGA |
| Leadless Chip Carriers/CSP |
| Double-sided SMT Assembly |
| Fine Pitch to 0.8mils |
| BGA Repair and Reball |
| Part Removal and Replacement |
| | Prototype & Low Volume PCB Assembly,from 1 Board to 250, or up to 1000 and customized |
| | SMT, Thru-hole |
| | Water Soluble Solder Paste, Leaded and Lead-Free |
| | Smallest:0.25*0.25 inches |
| Largest:20*20 inches |
| | Gerber files, Pick-N-Place file, Bill of Materials |
| | Turn-key,partial turn-key or consignment |
| | Cut Tape,Tube,Reels,Loose Parts |
| | Same day service to 15 days service |
| | Flying Probe Test,X-ray Inspection AOI Test |
| | Drilling----Exposure-----Plating-----Etaching & Stripping---Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling---- ICT-----Function Testing-----Temperature & Humidity Testing |