1×N PLC Wafer, Quartz-Based Planar Lightwave Circuit for Fiber Splitter Manufacturing
I. Core Optical Performance Advantages
- Superior Splitting Uniformity: Channel-to-channel uniformity error controlled within ±0.1-1.8dB (depending on specifications), ensuring consistent splitting after dicing and preventing uneven signal strength at terminals.
- Broad-Spectrum Compatibility: Supports full working band of 1260-1650nm, perfectly compatible with multi-wavelength transmission systems including GPON, EPON, and CATV, with exceptional versatility.
II. Material & Manufacturing Process Advantages
- High-Purity Fused Silica Substrate: Made of low-loss, high-stability fused silica (SiO₂), serving as core assurance for telecom-grade chips.
- Advanced P-CVD Deposition Process: Waveguide layer prepared via plasma chemical vapor deposition with film uniformity error ≤±2%, ensuring stable optical performance.
III. Size & Specification Advantages
- Standard Wafer Diameter Options: Available in full specifications including 2-inch, 4-inch, and 6-inch (e.g., 6-inch diameter 150±0.5mm) to accommodate different production capacity needs.
- Precise Thickness Control: Thickness tolerance ±50μm (e.g., 1050±100μm), ensuring consistent chip thickness after dicing for automated packaging.
IV. Application & Compatibility Advantages
- FTTH Network Core Compatibility: Low-loss characteristics perfectly suited for FTTH splitter chips, enabling large-scale user coverage.
- Full PON Network Compatibility: compatible with all GPON/EPON standards, serving as core component for passive optical network (PON) modules.
V. Quality & Production Assurance Advantages
- Telecom-Grade Quality Standards: Fully compliant with Telcordia GR-1221/1209 standards, passing 1000-hour high-temperature/high-humidity aging tests.
- 100% Inspection Guarantee: Each wafer undergoes 10 parameter tests including insertion loss and uniformity, with defect rate ≤0.1%.
- Comprehensive International Certifications: CE, RoHS, and ISO9001 certified, meeting global market requirements.