6L KB FR4 Multilayer High Density PCB Immersion Gold Plating for Universal Power Video from China

High Density PCB

Sep 02, 2024

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Product Description: 6L KB FR4 Multilayer High Density PCB Immersion Gold Plating for Universal Power Production Feature : Layer : 6Layers Base Material : KBFR4 Copper Thickness : 2 oz outlayer / 1.5 oz inner layer Board ...learn more

6L KB FR4 Multilayer High Density PCB Immersion Gold Plating for Universal Power

6L KB FR4 Multilayer High Density PCB Immersion Gold Plating for Universal Power

30000SQ.M/PER MONTH

Negotiable

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Accuracy Electronics Technologies Co.,Ltd

Active Member

6 Years

Half Holes High Density PCB , Printed Circuit Board Prototype Immersion Gold Surface Finishing

Half Holes High Density PCB , Printed Circuit Board Prototype Immersion Gold Surface Finishing

Half Holes High Density PCB , Printed Circuit Board Prototype Immersion Gold Surface Finishing

min line space/width is 4mil/ 0.10mm 3oz copper thickness Prototype PCB Board for 5G Electronics

min line space/width is 4mil/ 0.10mm 3oz copper thickness Prototype PCB Board for 5G Electronics

min line space/width is 4mil/ 0.10mm 3oz copper thickness Prototype PCB Board for 5G Electronics

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Electronic Control Multilayer PCB 0.1mm / 4mi Min Line Width 8 Layer Design

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Qi Wireless Charger 1.80mm FR4 Tg170 Prototype PCB Board With ENIG

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