1.80mm Thickness Multilayer PCB Board 6 Layer Circuit Board Immersion Gold
Production description :
this board is 6 layer with 1oz copper thickness for electronic device. we can accept any quantity board such as PCB prototype,samll volum, middle and large volume . no MOQ request for new order. all of these boards are met UL,TS16949, ISO9001 Etc.
Key Specifications/Special Features:
Material : | FR4 6layer |
Finish thickness : | 1.80 ±10%mm |
Minimum width/spacing : | 0.127 / 0.127mm |
Minimum via dia : | 0.2mm |
Surface finish : | Immersion gold |
Application : | Electronic device |
Solder mask : | green |
Legends : | White |
Certification : | ISO UL ROHS SGS |
Outline profile: | Punching, Routing , CNC routing + V-cut |
Solder mask : | LPI Solder mask, Peelable mask |
Certificate : | UL, CQC, TS16949, ISO14000, ROHS |
Board thickness: | 0.2-3.2mm |
Min finished hole size: | 0.10mm |
Impedance control: | +/- 10% |
PCBs which are widly used in following Electronics field:
Industril Control System
Power Supply
LED drive, LED Lighting
Communication Device
automotive electronics
Security Electronics
Household Control
Digital Appliances
Frequency converter
Medical Device
Full range of testing services:
▪ AOI, function testing, In circuit testing
▪ 3D paste thickness test
▪ Flash testing and earth bonding tests can also be undertaken where required
▪ Using our X-ray machine, we test PCBs to component level and all wiring is fully inspected and tested
▪ Each board is carefully examined by our dedicated inspection team using AOI and high magnification viewers
FAQ :
1. What are the main factors which will affect the price of PCB?
Material;
Surface finish;
Board thickness, Copper thickness;
Technology difficulty;
Different quality criteria;
PCB characteristics;
Payment terms;
2. How do ACCPCB ensure quality?
Our high quality standard is achieved with the following.
1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process
3. What kinds of boards can ACCPCB process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.
4. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.
5. How many types of surface finish ACCPCB can do?
O-the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.