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4 Layer FR4 TG170 Prototype PCB Board 0.8mm Thickness With Blind Buried Via
4 Layer FR4 TG170 Prototype PCB Board 0.8mm Thickness With Blind Buried Via
4 Layer FR4 TG170 Prototype PCB Board 0.8mm Thickness With Blind Buried Via
4 Layer FR4 TG170 Prototype PCB Board 0.8mm Thickness With Blind Buried Via
Specifications
Brand Name :
ACCPCB
Model Number :
P1116129
Certification :
ISO, UL, SGS,TS16949
Place of Origin :
China
MOQ :
10PCS
Price :
Negotiable
Payment Terms :
L/C / T/T / Western Union / Paypal
Supply Ability :
30,000SQ.M/Per Month
Delivery Time :
10-12days
Packaging Details :
Vacuum packing with desiccant
Material :
FR4 TG170
Thickness :
0.8mm
Surface Finish :
ENIG
Layer :
4L
Copper thicknes: :
10Z
PCB Standard :
IPC-A-610 D
Type :
customized PCB
Min Holes Size :
4mil
Min. Line Width :
4mil
Min Copper Thicness :
20um
Solder mask color :
Green,yellow, red, black etc.
Application :
antenna equipment
Description

4 Layer FR4 TG170 Prototype PCB Board 0.8mm Thickness With Blind Buried Via

Production description :

this board is 4 layer with 1oz copper thickness. it is used for antenna equipment. PCB prototype,small volum, middle and large volume are accepted. no MOQ request for new boards. for repeat order, just meet 3sq.m.

Key Specifications of High Voltage PCB:

Production Types: high TG Rigid PCB

Layer :

4 Layers
Base Material : FR4 tg170
Copper Thickness : 1oz
Board Thickness : 0.80 mm
Min. Finish Hole Size : 8 mil (0.10mm)
Min. Line Width : 4 mil
Min. Line Spacing : 4 mil
Surface Finishing : ENIG
Drilling hole tolerance: +/-3 mil ( 0.075mm )
Min Outline tolerance : +/-4 mil ( 0.10mm )
Working panel size : max:1200mmX600mm (47'' X24'')
Outline profile: Punching, Routing , CNC routing + V-cut
Solder mask : LPI Solder mask, Peelable mask
Solder Mask Color : Blue, black,yellow, matte green
Certificate : UL, CQC, TS16949, ISO14000, ROHS
Silkscreen color : White
Twist and Bow : no more than 0.75 %

Products Application:

Our products are widely used in meter, medical, solar energy, mobile, communication, industrial control, power electronics,security, consum electronics, computer, automotive, aerospace, military and so on.

Rigid PCB Technical Capability:

Items Technical Capability
Layers 1-28 layers Min. line width/space 4mil

Max.board size (single&doule

sided)

 600*1200mm Min.annular ring width: vias 3mil
Surface finish

HAL lead free,gold flash

Immersion silver,Immersion gold ,Immersion Sn,

hard gold,OSP,ect

 Min.board thickness(multilayer) 4layers:0.4mm;
6layers:0.6mm;
8layers:1.0mm;
10layers:1.20mm
Board materials

FR-4; high Tg; high CTI; halogen free; high frequency(rogers,taconic,

PTFE,nelcon,

ISOLA,polyclad 370 HR); heavy copper,

Metal base clade laminate

Plating thickness (Technique:

Immersion Ni/Au)

 Plating type: Imm Ni, Min./Max thickness:100/150U'' Plating type: Imm Au, Min./Max thickness:2/4U''
Impedance control ± 10%

Distance between

line to board edge

Outline: 0.2mm

V-CUT: 0.4mm

Base copper thickness(Inner

and outer layer)

 Min. thickness: 0.5 OZ Max.thickness: 6OZ Min.hole size(board thickness ≥2mm) Aspect ratio≤16
Finished copper thickness Outer layers:
Min.thickness 1 OZ,
Max.thickness 10 OZ
Inner layers:
Min.thickness :0.5OZ,
Max.thickness : 6 OZ
 Max.board thickness(single&doule sided) 3.20mm


4 Layer FR4 TG170 Prototype PCB Board 0.8mm Thickness With Blind Buried Via

FAQ :

1. How do ACCPCB ensure quality?

Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

2. What kinds of boards can ACCPCB process?

Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.


3. What data are needed for PCB production?

PCB Gerber files with RS-274-X format.


4. What’s the typical process flow for multi-layer PCB?

Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.


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4 Layer FR4 TG170 Prototype PCB Board 0.8mm Thickness With Blind Buried Via

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Product Detail
Brand Name :
ACCPCB
Model Number :
P1116129
Certification :
ISO, UL, SGS,TS16949
Place of Origin :
China
MOQ :
10PCS
Price :
Negotiable
Contact Supplier
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4 Layer FR4 TG170 Prototype PCB Board 0.8mm Thickness With Blind Buried Via
4 Layer FR4 TG170 Prototype PCB Board 0.8mm Thickness With Blind Buried Via

Accuracy Electronics Technologies Co.,Ltd

Active Member
6 Years
guangdong, shenzhen
Since 2003
Business Type :
Manufacturer, Exporter
Main Products :
Prototype PCB Board, LED Light PCB Board, HDI PCB Board
Total Annual :
3.1Million-4.7Million
Employee Number :
450~500
Certification Level :
Active Member
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