OEM Double Sides SMD LED Light PCB Board Printed Service Quick Turn 1.3 Oz Copper
Production description :
this board is 2layer with 1.3 oz copper thickness. it is used on high voltage equipment. PCB prototype,small volum, middle and large volume are accepted. no MOQ request for new boards. for repeat order, just meet 3sq.m.
Key Specifications/Special Features:
Base material : | FR4 2 layer |
Copper thickness : | 1.3 / 1.3 oz |
Board thickness : | 1.25mm |
Min. hole size : | 0.4mm |
Min. line width : | 9 mils |
Min. line spacing : | 9 mils |
Surface finishing : | Immersion gold |
Application : | LED lighting |
Board thickness tolerance : | ±10% |
Twist& wrap : | ≤ 0.5% |
Aspect ration: | max 10:1 |
Copper thickness: | 0.02-0.035mm |
outline profile: | punching, routing, v-cuting |
outline tolerance: | +/-10% |
twist and bow: | mo more than 0.75% |
impedance control: | +/-10% |
Technology Capability:
Item | Technical Parameters |
Layers | 1-28 Layers |
Inner Layer Min Trace/Space | 4/4 mil |
Out Layer Min Trace,Space | 4/4 mil |
Inner Layer Max Copper | 4 OZ |
Out Layer Max Copper | 4 OZ |
Inner Layer Min Copper | 1/3 oz |
Out Layer Min Copper | 1/3 oz |
Min hole size | 0.15 mm |
Max.board thickness | 6 mm |
Min.board thickness | 0.2mm |
Max.board size | 680*1200 mm |
PTH Tolerance | +/-0.075mm |
NPTH Tolerance | +/-0.05mm |
Countersink Tolerance | +/-0.15mm |
Board Thickness Tolerance | +/-10% |
Min BGA | 7mil |
Min SMT | 7*10 mil |
Solder mask bridge | 4 mil |
Solder mask color | White,black,blue,green,yellow,red,etc |
Legend color | White,black,yellow,gray,etc |
Surface finish | HAL,OSP, Immersion Ni/Au ,Imm silver/SN,ENIG |
Board materials | FR-4;high TG;HighCTI; halogen free; Aluminum Bsed PCB,high frequency(rogers,isola),copper -base PCB |
Impedance control | +/-10% |
Bow and twist | ≤0.5 |
FAQ:
1. What kinds of boards can ACCPCB process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.
2. What data are needed for PCB production?
PCB Gerber files with RS-274-X format.
3. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.
4. What are the main factors which will affect the price of PCB?
Material;
Surface finish;
Board thickness, Copper thickness;
Technology difficulty;
Different quality criteria;
PCB characteristics;
Payment terms;
5. How do ACCPCB ensure quality?
Our high quality standard is achieved with the following.
1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process
Application:
Widely used in stage, Industrila control,computer,consuming electronics,security,automotive,power electronics,medical,telecom etc.
Any further question, welcome to contact us by sending your inquiries