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High Density Immersion Gold 2.0mm 4mil FR4 10 Layer PCB
High Density Immersion Gold 2.0mm 4mil FR4 10 Layer PCB
High Density Immersion Gold 2.0mm 4mil FR4 10 Layer PCB
High Density Immersion Gold 2.0mm 4mil FR4 10 Layer PCB
Specifications
Brand Name :
ACCPCB
Model Number :
S102134
Certification :
ISO,SGS,TS16949
Place of Origin :
China
MOQ :
1 PCS
Price :
Negotiable
Payment Terms :
T/T ,Western Union,Paypal
Supply Ability :
50000SQ.M/Per Month
Delivery Time :
3-5days
Packaging Details :
Vacuum packing
Material :
FR4
Count :
10layer
Surface Finish :
Immersion gold
Application :
Router
Solder Mask :
Blue,Green,black, yellow etc.
Copper thickness :
2oz all layer
Min. hole size :
8 mil/6 mil
Min. line spacing :
4mil
Min. line width :
4mil
Service :
Customized PCB
Description

High Density Immersion Gold 2.0mm 4mil FR4 10 Layer PCB

10Layer FR4 High Density PCB with Immersion Gold and 2.0mm board thickness

Production description :

this board is 10layer with 1oz copper thickness. it is used on router device. PCB prototype,samll volum, middle and large volume are accepted. no MOQ request for new order. all of these boards are met UL,TS16949, ISO9001 Etc.

Key Specifications of high frequency board :

Production Types:

Rigid PCB

Layer :

10layer

Base Material :

FR4

Copper Thickness :

1 oz

Board Thickness :

0.4mm

Min. Finish Hole Size :

8 mil (0.20mm)

Min. Line Width :

4 mil

Min. Line Spacing :

4 mil

Surface Finishing :

ENIG

Drilling hole tolerance:

+/-3 mil ( 0.075mm )

Min Outline tolerance :

+/-4 mil ( 0.10mm )

Working panel size :

max:1200mmX600mm (47'' X24'')

Outline profile:

Punching, Routing , CNC routing + V-cut

Solder mask :

LPI Solder mask, Peelable mask

Solder Mask Color :

Blue, black,yellow, matte green

Certificate :

UL, CQC, TS16949, ISO14000, ROHS

Silkscreen color :

White

Twist and Bow :

no more than 0.75 %

PCB Flow Chart.pdf

Products Application:

1, Security monitor: Moible phone, PDA, GPS, caramer monitor etc;

2, Telecom Communication :wireless LAN card, XDSL router,Servers, Optical Device,Hard Drive etc;

3, Consumer Electronics: TV, DVD,Digital Caramer, air conditoner, Refrigerator,set-top box etc;

4, Vehicle Electronices: Car etc;

5, Industrial controls: Medical device ,UPS equipment, Control device etc;

6, Military & Defense : Military Weapons etc;

High Density Immersion Gold 2.0mm 4mil FR4 10 Layer PCB

Technology Capability:

Item

Technical Parameters

Layers

1-28 Layers

Inner Layer Min Trace/Space

4/4 mil

Out Layer Min Trace,Space

4/4 mil

Inner Layer Max Copper

4 OZ

Out Layer Max Copper

4 OZ

Inner Layer Min Copper

1/3 oz

Out Layer Min Copper

1/3 oz

Min hole size

0.15 mm

Max.board thickness

6 mm

Min.board thickness

0.2mm

Max.board size

680*1200 mm

PTH Tolerance

+/-0.075mm

NPTH Tolerance

+/-0.05mm

Countersink Tolerance

+/-0.15mm

Board Thickness Tolerance

+/-10%

Min BGA

7mil

Min SMT

7*10 mil

Solder mask bridge

4 mil

Solder mask color

White,black,blue,green,yellow,red,etc

Legend color

White,black,yellow,gray,etc

Surface finish

HAL,OSP, Immersion Ni/Au ,Imm silver/SN,ENIG

Board materials

FR-4;high TG;HighCTI; halogen free; Aluminum Bsed PCB,high frequency(rogers,isola),copper -base PCB

Impedance control

+/-10%

Bow and twist

≤0.5

High Density Immersion Gold 2.0mm 4mil FR4 10 Layer PCB

FAQ :

1. How do ACCPCB ensure quality?

Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

2. What kinds of boards can ACCPCB process?

Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.


3. What data are needed for PCB production?

PCB Gerber files with RS-274-X format.


4. What’s the typical process flow for multi-layer PCB?

Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.


5. How many types of surface finish ACCPCB can do?

the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.

Product tags

four layer immersion gold pcb

,

6 layers immersion gold pcb

,

immersion gold multilayer pcb
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High Density Immersion Gold 2.0mm 4mil FR4 10 Layer PCB

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Product Detail
Brand Name :
ACCPCB
Model Number :
S102134
Certification :
ISO,SGS,TS16949
Place of Origin :
China
MOQ :
1 PCS
Price :
Negotiable
Contact Supplier
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High Density Immersion Gold 2.0mm 4mil FR4 10 Layer PCB
High Density Immersion Gold 2.0mm 4mil FR4 10 Layer PCB

Accuracy Electronics Technologies Co.,Ltd

Active Member
6 Years
guangdong, shenzhen
Since 2003
Business Type :
Manufacturer, Exporter
Main Products :
Prototype PCB Board, LED Light PCB Board, HDI PCB Board
Total Annual :
3.1Million-4.7Million
Employee Number :
450~500
Certification Level :
Active Member
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